公开(公告)号：MY125344A

公开(公告)日：2006-07-31

申请号：MYPI20003159

申请日：2000-07-10

Applicant: IBM

Inventor： KONSTANTINOS I PAPATHOMAS ,  STEPEHN LESLIE BUCHWALTER ,  HUNG MANH DANG ,  MICHAEL ANTHONY GAYNES

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/433 ,  H01L23/52

Abstract: AN ELECTRONIC STRUCTURE BONDABLE TO AN ELECTRONIC ASSEMBLY, SUCH AS CHIP.THE ELECTRONIC STRUCTURE MAY BE JOINED TO A ELECTRONIC ASSEMBLY, SUCH AS CHIP, BY USE OF A STRUCTURAL EPOXY ADHESIVE. THE ELECTRONIC STRUCTURE INCLUDES A MINERAL LAYER ON A METALLIC PLATE, AND AN ADHESION PROMOTER LAYER ON THE MINERAL LAYER. THE METALLIC PLATE INCLUDES A METALLIC SUBTANCE THAT INCLUDES A PURE METAL WITH OR WITHOUT A METAL COATING. THE METALLIC SUBTANCE MAY INCLUDE SUCH SUBTANCES AS STAINLESS STEEL,ALUMINIUM,TITANIUM,COPPER,COPPER COATED WITH NICKEL,AND COPPER COATED WITH CHROME. THE MINERAL LAYER INCLUDES A CHEMICAL COMPOUND DERIVED FROM A MINERAL; E.G.,SILICON(SIO?) DERIVED FROM QUARTZ. SUCH CHEMICAL COMPOUNDS MAY INCLUDE SUCH SUBTANCES AS SILICON DIOXIDE, SILICON NITRIDE, AND SILICON CARBIDE. THE CHEMICAL COMPOUND MAY EXIST IN EITHER CRYSTALLINE AMORPHOUS FORM. THE ADHESION PROMOTER MAY INCLUDE SUCH CHEMICAL SUBTANCES AS SILANES, TITANATES, ZIRCONATES, AND ALUMINATES.(FIGURE 4)

公开(公告)号：MY112145A

公开(公告)日：2001-04-30

申请号：MYPI19951098

申请日：1995-04-26

Applicant: IBM

Inventor： PING KWONG SETO ,  THOMAS MORAN CULNANE ,  MICHAEL ANTHONY GAYNES ,  HUSSAIN SHAUKATULLAH

IPC: H01L21/265 ,  H01L21/56 ,  H01L23/40 ,  H01L23/31 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42

Abstract: AN ALUMINUM OR COPPER HEAT SINK IS ATTACHED TO A CERAMIC CAP OR EXPOSED SEMICONDUCTOR CHIP USING FLEXIBLE-EPOXY TO PROVIDE IMPROVED THERMAL PERFORMANCE. THE ALUMINUM MAY BE COATED BY ANODIZING OR CHROMATE CONVERSION OR THE COPPER MAY BE COATED WITH NICKEL. SUCH STRUCTURES ARE ESPECILLY USEFUL FOR CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, SINGLE LAYER CERAMIC, AND OTHER CHIP CARRIER PACKAGES AS WELL AS FOR FLIP CHIP ATTACHMENT TO FLEXIBLE OR RIGID ORGANIC CIRCUIT BOARDS. THESE ADHESIVE MATERIALS WITHSTAND THERMAL CYCLE TESTS-OF 0 TO 1000 C FOR 1,500 CYCLES, -2.5 TO 125? C FOR 400 CYCLES, AND -40 TO 140? C FOR 300 CYCLES; AND WITHSTAND CONTINUOUS EXPOSURE AT 130? C FOR 1000 HOURS WITHOUT LOSS OF STRENGTH. FLEXIBLE-EPOXIES HAVE A MODULUS OF ELASTICITY BELOW 100,000 PSI AND A GLASS TRANSITION TEMPERATURE BELOW 25? C, ARE MUCH STRONGER THAN TYPICAL SILICONE ADHESIVES, AND DO NOT CONTAMINATE THE MODULE OR CIRCUIT BOARD WITH SILICONE. THE FLEXIBLE EPOXY MAY CONTAIN A MATERIAL HAVING A LOW COEFFICIENT OF THERMAL EXPANSION (CTE) IN ORDER TO PROVIDE A CTE BETWE~N THAT OF THE SILICON DIE AND THE METAL OF THE HEAT SINK .(FIGURE 1)