Abstract:
996,152. Semi-conductor devices. INTERNATIONAL BUSINESS MACHINES CORPORATION. May 30, 1962 [June 30, 1961], No. 20756/62. Heading H1K. A semi-conductor device includes a body of semi-conductor material containing at least two activators characteristic of the same conductivity type, the total amount of activator being sufficient to render the material degenerate and the relative proportions of the activators being such that the average radius of the activator atoms and the mean radius of the atoms of the semi-conductor are matched to within 3%. In a typical device a tunnel diode is constructed from a germanium wafer degenerately doped with arsenic and antimony atoms in a ratio between 3:1 and 10: 1 (3À5 to 1 providing exact matching). An insulating layer 11 (Fig. 1b of quartz or silicon monoxide is evaporated on the wafer through a mask and an electrode 12 consisting of at least 98% by weight indium, balance gallium sputtered or evaporated over it. The assembly is then heated to alloy the electrode to the wafer at 14 to form a tunnel PN junction. After thermo-compression bonding wire 15 to electrode 12 and attaching an electrode 16 the wafer is etched to the form shown as described in Specification 996,151, The matching of the average impurity atom diameter with that of the semi-conductor reduces the valley current of the diode, and the particular combination of antimony and aresenic as impurities reduces, eliminates or reverses the variation of the peak current with temperature according to the ratio of antimony to aresenic atoms used.
Abstract:
A PLURALITY OF CONNECTIONS FROM ELECTRICALLY CONDUCTIVE LANDS ON AN INSULATING SUBSTRATE TO THE CONTACTS OF A SOLID STATE DEVICE ARE FORMED IN ONE OPERATION BY FIXEDLY POSITIONING THE DEVICE ON, OR IN A CAVITY WITHIN, THE SUBSTRATE. A DECAL, INCLUDING A BACKING PLATE WITH A PLURALITY OF CONDUCTIVE STRIPS WHICH CAN BE ADHERED TO THE PLATE BY MEANS OF A SOLUBLE ADHESIVE, IS POSITIONED OVER THE DEVICE BEARING SUBSTRATE WITH THE STRIPS IN REGISTRY WITH RESPECTIVE CONTACTS AND LANDS. THE STRIPS ARE BROUGHT INTO CONTACT WITH RESPECTIVE CONTACT AND LAND SURFACE PORTIONS AND SUBJECTED TO HEAT AND PRESSURE SUFFICIENT TO CAUSE BONDING THEREBETWEEN. THEREAFTER, THE DECAL BACKING PLATE MAY BE REMOVED FROM THE STRIPS, AS BY DISSOLVING THE ADHESIVE, LEAVING THE STRIPS FIRMLY BONDED TO THE CONTACTS AND LANDS AND BRIDGING THE SPACE THEREBETWEEN, WHEREBY THE LANDS ARE CONNECTED TO THE CONTACTS THROUGH THE STRIPS.