公开(公告)号：US3434896A

公开(公告)日：1969-03-25

申请号：US3434896D

申请日：1965-07-30

Applicant: IBM

Inventor： CHANCE DUDLEY A

IPC: H01L21/311 ,  H01L7/50 ,  B32B31/24

CPC classification number: H01L21/31111

公开(公告)号：US3614832A

公开(公告)日：1971-10-26

申请号：US3614832D

申请日：1966-03-09

Applicant: IBM

Inventor： CHANCE DUDLEY A ,  IM SAMUEL S ,  PERRI JOHN A ,  RISEMAN JACOB

IPC: B23K1/005 ,  H01L29/12 ,  H01R12/71 ,  H05K3/30

CPC classification number: B23K1/0056 ,  B23K2201/38 ,  H01L24/24 ,  H01L24/82 ,  H01L29/12 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  Y10T29/49128 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A PLURALITY OF CONNECTIONS FROM ELECTRICALLY CONDUCTIVE LANDS ON AN INSULATING SUBSTRATE TO THE CONTACTS OF A SOLID STATE DEVICE ARE FORMED IN ONE OPERATION BY FIXEDLY POSITIONING THE DEVICE ON, OR IN A CAVITY WITHIN, THE SUBSTRATE. A DECAL, INCLUDING A BACKING PLATE WITH A PLURALITY OF CONDUCTIVE STRIPS WHICH CAN BE ADHERED TO THE PLATE BY MEANS OF A SOLUBLE ADHESIVE, IS POSITIONED OVER THE DEVICE BEARING SUBSTRATE WITH THE STRIPS IN REGISTRY WITH RESPECTIVE CONTACTS AND LANDS. THE STRIPS ARE BROUGHT INTO CONTACT WITH RESPECTIVE CONTACT AND LAND SURFACE PORTIONS AND SUBJECTED TO HEAT AND PRESSURE SUFFICIENT TO CAUSE BONDING THEREBETWEEN. THEREAFTER, THE DECAL BACKING PLATE MAY BE REMOVED FROM THE STRIPS, AS BY DISSOLVING THE ADHESIVE, LEAVING THE STRIPS FIRMLY BONDED TO THE CONTACTS AND LANDS AND BRIDGING THE SPACE THEREBETWEEN, WHEREBY THE LANDS ARE CONNECTED TO THE CONTACTS THROUGH THE STRIPS.

公开(公告)号：US3355335A

公开(公告)日：1967-11-28

申请号：US40224864

申请日：1964-10-07

Applicant: IBM

Inventor： BUTLER JAMES H ,  CHANCE DUDLEY A ,  IM SAMUEL S

IPC: H01L21/00 ,  H01L23/29 ,  H01L29/00

CPC classification number: H01L23/291 ,  H01L21/00 ,  H01L29/00 ,  H01L2924/0002 ,  Y10S148/071 ,  Y10S148/107 ,  Y10S148/152 ,  Y10S438/979 ,  H01L2924/00

公开(公告)号：FR2309999A1

公开(公告)日：1976-11-26

申请号：FR7533885

申请日：1975-10-31

Applicant: IBM

Inventor： CHANCE DUDLEY A

IPC: H01S3/038 ,  H01S3/03 ,  H01S3/08 ,  H01S3/22 ,  H01S3/06

公开(公告)号：CA2024383A1

公开(公告)日：1991-04-07

申请号：CA2024383

申请日：1990-08-31

Applicant: IBM

Inventor： CHANCE DUDLEY A ,  GOLAND DAVID B ,  TONG HO-MING NMN

IPC: H01L23/08 ,  H01L21/48 ,  H01L21/50 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: A hermetic package for an electronic device is manufactured by providing a green glass ceramic body (10) with a green via (20)to produce a workpiece. The workpiece (24) is sintered at a temperature at or above 500 DEG C, while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity. The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via. The workpiece may be sintered in a sintering fixture having a frame (44) and a compensating insert (46). The compensating insert and frame bound a sintering chamber for accommodating the workpiece. By providing a frame having a thermal expansion coefficient greater than that of the workpiece, and by providing a compensating insert having a thermal expansion coefficient greater than that of the frame, a close fit can be assured between the workpiece and the sintering fixture over a large range of temperatures.

公开(公告)号：CA2024383C

公开(公告)日：1993-10-12

申请号：CA2024383

申请日：1990-08-31

Applicant: IBM

Inventor： CHANCE DUDLEY A ,  GOLAND DAVID B ,  TONG HO-MING

IPC: H01L23/08 ,  H01L21/48 ,  H01L21/50 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H01L23/28 ,  H01L21/52 ,  H01L21/56

Abstract: HERMETIC PACKAGE FOR AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree.C, while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity. The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via. The workpiece may be sintered in a sintering fixture having a frame and a compensating insert. The compensating insert and frame bound a sintering chamber for accommodating the workpiece. By providing a frame having a thermal expansion coefficient greater than that of the workpiece, and by providing a compensating insert having a thermal expansion coefficient greater than that of the frame, a close fit can be assured between the workpiece and the sintering fixture over a large range of temperatures.

公开(公告)号：CA905010A

公开(公告)日：1972-07-11

申请号：CA905010D

Applicant: IBM

Inventor： RISEMAN JACOB ,  CHANCE DUDLEY A ,  PERRI JOHN A ,  IM SAMUEL S

IPC: B23K1/005 ,  H01L29/12 ,  H05K3/30

公开(公告)号：FR2314601A1

公开(公告)日：1977-01-07

申请号：FR7610908

申请日：1976-04-08

Applicant: IBM

Inventor： CHANCE DUDLEY A ,  CHASTANG JEAN-CLAUDE A ,  LUSSOW ROBERT O

IPC: H01S3/03 ,  H01S3/101 ,  H01S3/23 ,  H01S3/02