公开(公告)号：SG118102A1

公开(公告)日：2006-01-27

申请号：SG200107602

申请日：2001-12-07

Applicant: IBM

Inventor： CABRAL CYRIL JR ,  ROY ARTHUR CARRUTHERS ,  JAMES MCKELL EDWIN HARPER ,  CHAO-KUN HU ,  KIM YANG LEE ,  ISMAIL CEVDET NOYAN ,  ROBERT ROSENBERG ,  THOMAS MCCARROLL SHAW

IPC: H01L21/28 ,  B32B15/01 ,  C22C27/02 ,  H01L21/768 ,  H01L23/532 ,  H01L23/485

Abstract: An electrical conductor for use in an electronic structure is disclosed which includes a conductor body that is formed of an alloy including between about 0.001 atomic % and about 2 atomic % of an element selected from the group consisting of Ti, Zr, In, Sn and Hf; and a liner abutting the conductor body which is formed of an alloy that includes Ta, W, Ti, Nb and V. The invention further discloses a liner for use in a semiconductor interconnect that is formed of a material selected from the group consisting of Ti, Hf, In, Sn, Zr and alloys thereof, TiCu3, Ta1-XTix, Ta1-X, Hfx, Ta1-X, Inxy, Ta1-XSnx, Ta1-XZrx.