公开(公告)号：JPH05291363A

公开(公告)日：1993-11-05

申请号：JP34178292

申请日：1992-12-22

Applicant: IBM

Inventor： BERUNARUDO HERUNANDESU ,  REIMONDO ROBAATO HOOTON ,  ISUMAIRU CHIEBUDETO NOYAN ,  MAIKERU JIYON PARUMAA ,  MAAKU BII RITSUTAA

IPC: H01L21/60 ,  B08B3/02 ,  B23K1/018 ,  B26F3/00 ,  H05K13/04

Abstract: PURPOSE: To provide a method and apparatus for removing a wire, bonded between a contact pad of a chip and a contact pad of a substrate by using an alternating flow of a fluid. CONSTITUTION: A nozzle 32 having a plurality of air jets in a cavity in which a chip is housed is arranged on the chip, so as to surround chip contact pads 6, substrate contact pads 10, and wires 4 bonded between the pads 6 and 10. Air flows from the plurality of jets, alternate air currents in the clockwise and counterclockwise directions are generated, a plurality of wires are bent forward and backward, fatigue is generated at contact points between the substrate contact pads and the chip contact pads 6, and the wires 4 are cut at the contact points almost at the same time. The nozzle 32 has holes, and air escapes from the holes. The cut wires 4 are carried out and caught by a filter.