公开(公告)号：JPH08213852A

公开(公告)日：1996-08-20

申请号：JP27924195

申请日：1995-10-26

Applicant: IBM

Inventor： DENISU RII ROJIYAASU ,  MAAKU BII RITSUTAA

IPC: H03F3/08 ,  H04B10/04 ,  H04B10/06 ,  H04B10/14 ,  H04B10/26 ,  H04B10/43 ,  H04B10/28

Abstract: PROBLEM TO BE SOLVED: To shunt the excessive photoelectric current of an optical receiver by providing a shunt circuit which prevents the output current of a photodetector which receives optical pulses from reaching the input of an amplifier when the current exceeds a prescribed threshold. SOLUTION: A clamp circuit is composed of resistors R1 and R2 respectively connected to a photodiode and the cathode of the photodiode, capacitors C2 and C3 respectively connected to the junctions of the resistors R1 and R2, and a differential amplifier circuit A1 connected to both ends of the photodiode. When the output current of the photodiode exceeds a prescribed threshold, the output current is prevented from flowing in the amplifier A1 by short- circuiting the excessive current by turning on FETs Q1 and Q2.

公开(公告)号：JPH05211281A

公开(公告)日：1993-08-20

申请号：JP18924292

申请日：1992-07-16

Applicant: IBM

Inventor： POORU UIRIAMU KOTEUSU ,  POORU ANDORIYUU MOSUKOUITSUTSU ,  FUIRITSUPU MAFUII ,  MAAKU BII RITSUTAA ,  JIYOOJI FUREDERITSUKU UOOKAA

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/20

Abstract: PURPOSE: To provide an electronic device package which can stack electronic devices with high density, can secure electrical interconnection of the electronic devices and can have superior heat radiation effect. CONSTITUTION: A plurality of electronic devices 40 are arranged in a stacked manner, and each has a contact position 24 close to one end of each device. The electronic devices are arranged as in steps, so that the lower contact positions of the devices are exposed and are arranged along contact positions 46 on a substrate as opposite thereto, whereby the devices are electrically connected with the substrate. Thereby a large number of electronic devices of the step-like structure can be packaged with a high density and can easily radiate heat, generated in the electronic devices when combined with a heat radiating means 50.

公开(公告)号：JPH05291363A

公开(公告)日：1993-11-05

申请号：JP34178292

申请日：1992-12-22

Applicant: IBM

Inventor： BERUNARUDO HERUNANDESU ,  REIMONDO ROBAATO HOOTON ,  ISUMAIRU CHIEBUDETO NOYAN ,  MAIKERU JIYON PARUMAA ,  MAAKU BII RITSUTAA

IPC: H01L21/60 ,  B08B3/02 ,  B23K1/018 ,  B26F3/00 ,  H05K13/04

Abstract: PURPOSE: To provide a method and apparatus for removing a wire, bonded between a contact pad of a chip and a contact pad of a substrate by using an alternating flow of a fluid. CONSTITUTION: A nozzle 32 having a plurality of air jets in a cavity in which a chip is housed is arranged on the chip, so as to surround chip contact pads 6, substrate contact pads 10, and wires 4 bonded between the pads 6 and 10. Air flows from the plurality of jets, alternate air currents in the clockwise and counterclockwise directions are generated, a plurality of wires are bent forward and backward, fatigue is generated at contact points between the substrate contact pads and the chip contact pads 6, and the wires 4 are cut at the contact points almost at the same time. The nozzle 32 has holes, and air escapes from the holes. The cut wires 4 are carried out and caught by a filter.

公开(公告)号：JPH05205832A

公开(公告)日：1993-08-13

申请号：JP23899692

申请日：1992-08-15

Applicant: IBM

Inventor： REIMONDO ROBAATO HOOTON ,  ISUMAIRU SEBUDETSUTO NOIAN ,  MAIKERU JIYON PAAMA ,  MAAKU BII RITSUTAA

IPC: H01R24/00 ,  H01R12/62 ,  H01R12/72 ,  H05K3/36 ,  H05K7/02

Abstract: PURPOSE: To connect external wiring conductor patterns to device support conductor patterns. CONSTITUTION: In a mutual connection and mounting technology using the elastomer characteristics, a mounting member 8 catches an edge 5 of a device support planer member 1 having device conductors 3, 4 on the edge 5 in a notch 7. The device conductors 3, 4 are provided on the surface of the mounting member 8 so as to be brought into contact with device conductors 9, 10 in the notch 7, and connected to external wiring conductors 12, 13 on an external wiring planer member 14. A connected conductor of the external wire 14 and the device conductors 9, 10 is on the flexible tape containing the elastomer contact adaptation. The holding force 15 to compress the mounting member 8 and hold the mounting member 8 on the external wiring planer member 14 is provided.

公开(公告)号：JPH04233246A

公开(公告)日：1992-08-21

申请号：JP13541091

申请日：1991-04-17

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORA ,  REIMONDO ROBAATO HOOTON ,  ARUFUONSO FUIRITSUPU RANZETSUT ,  MAIKERU JIYON PARUMAA ,  MAAKU BII RITSUTAA

IPC: H01L21/60 ,  H01L21/00

Abstract: PURPOSE: To move a tape without bringing a lead frame into contact with a circuit on a tape, and enable the suitable positioning of a chip on a TAB lead frame. CONSTITUTION: A stationary jaw assembly 12 is provided with facing jaws 122, 124 which clamp the end portion of a tape 22, when closed and release the end portion, when opened. A movable gripping assembly 10 is provided with a lower movable gripper 72 positioned below a tape and an upper movable gripper 100 positioned above the tape. Both grippers move in the directions of approaching and leaving to and from the tape 22. In the case of approaching, the grippers clamp the tape. By a tape feeder, the movable gripper assembly is made to reciprocate so that it approaches the stationary jaw assembly and leaves away from it along the length of the tape.

公开(公告)号：JPH09172411A

公开(公告)日：1997-06-30

申请号：JP27199796

申请日：1996-10-15

Applicant: IBM

Inventor： RABI SHIYANKAA ANASU ,  SAJIIRU MUNISUWAMI GOODA ,  MAAKU SAMUSON MIRUSHIYUTEIN ,  MAAKU BII RITSUTAA ,  DENISU RII ROJIYAAZU

IPC: H04B10/60 ,  H04B10/07 ,  H04B10/114 ,  H04B10/40 ,  H04B10/50 ,  H04B10/69 ,  H04B10/28 ,  H04B10/04 ,  H04B10/06 ,  H04B10/14 ,  H04B10/26

Abstract: PROBLEM TO BE SOLVED: To obtain an automatically adaptive threshold setting circuit by measuring a current flowing a reverse bias IR light detector corresponding to the surrounding light level and using this current for adjusting the sensitivity of a receiver. SOLUTION: The current flowing through a resistor 21 is a function of surrounding light in the light detector 11, the outputs of a buffer and a level shifter 22 becomes input to a current mirror consisting of transistors 23 and 24, and the current mirror operates as a variable impedance. One input of a level restoring circuit 26 is connected to the positive input of an amplifier 17 to be a node A and the other input is connected to a node B. A threshold is set by drawing a current through a resistor 25 and generating voltage at the node B so as to sense a voltage level at the output of the post amplifier 17. Then voltage at a node C is always offset from a level at the node A to be positive and this offset quantity is the threshold.

公开(公告)号：JPH0540214A

公开(公告)日：1993-02-19

申请号：JP11769391

申请日：1991-05-22

Applicant: IBM

Inventor： MAAKU FUIIRUDEINGU BURETSUGUMA ,  UIRIAMU DEIIN BUREWAA ,  MITSUCHIERU SHIMONZU KOOHEN ,  GUREN UORUDEN JIYONSON ,  ISUMAIRU SEBUDETSUTO NOYAN ,  MODESUTO MAIKERU OPURISUKO ,  MAAKU BII RITSUTAA ,  DENISU RII ROJIYAAZU ,  JIININ MADERIN TOREUERA

IPC: G02B6/42 ,  G02B6/43 ,  H01L31/12 ,  H01L31/167 ,  H04B10/00

Abstract: PURPOSE: To provide an electrooptical connector which copes with high-density applications and meets positioning requests in a wide range and has a high optical crosstalk immunity. CONSTITUTION: A connector provided with an upper half part and a low half part 201 is provided, and each half part is provided with an LED chip 202 or 204 and a detector chip 203 or 205, and a small lens array 210 acting as an energy transfer medium is provided between two half parts to form optical connection.