公开(公告)号：JPH06104374A

公开(公告)日：1994-04-15

申请号：JP24732291

申请日：1991-09-26

Applicant: IBM

Inventor： REIMONDO ROBAATO HOOTON ,  ARUFUONSO FUIRITSUPU RANZETSUT ,  ISUMAIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA

IPC: H01L23/50 ,  H01L21/48 ,  H05K3/34 ,  H05K13/00

Abstract: PURPOSE: To provide an electronic circuit packaging interface adaptable to high conductor density, which connects a plurality of conductors and a plurality of contact parts formed on the surface of a substrate, wherein the conductors are provided in rows on a conductor carrier at narrow intervals. CONSTITUTION: Conductors 6 and 7 extending from an edge 9 of a carrier 5 in a cantilever fashion are connected to contact parts 3 and 4. The conductors neighboring each other are connected to the contact parts, which are formed at positions having different distances 10 and 11 from the carrier. Each conductor is extended on a supporting surface to the vicinity of the contact part to which the conductor is connected, bent at the vicinity and extended towards a substrate 2 at a generally vertical angle. Further, the conductor is bent near the contact part, and the tip of the conductor is horizontally extended along the contact part.

公开(公告)号：JPH0464253A

公开(公告)日：1992-02-28

申请号：JP32341590

申请日：1990-11-28

Applicant: IBM

Inventor： MAAKU FUIIRUDENGU BUREGUMAN ,  REIMONDO ROBAATO HOOTON ,  IZUMEIRU SEBUDETO NOOYAN ,  MAIKERU JIYON PARUMAA

IPC: H01L23/08 ,  H01L21/48 ,  H01L23/04 ,  H01L23/06 ,  H01L23/14

Abstract: PURPOSE: To eliminate thermal mismatching among a chip, a substrate, and a cap by forming them with a same substance. CONSTITUTION: In a non-hermetic package, a groove 110 is etched so that it operates as the reservoir of a seal agent. Then, for mounting a chip on a substrate, the depth of a recess 125 is designed so that the surrounding part of a cap 100 becomes flush with the chip surface, when using a flip-chip structure, thus forming an extremely compact package. To eliminate mutual thermal mismatching, a semiconductor substrate, at least one semiconductor electron device, and a cap for package are formed by a same semiconductor substance, each device is mounted onto the substrate, an electrical connection is formed on at least one semiconductor electronic device and substrate, at least one device cap is covered, and the cap is directly mounted to the substrate.

公开(公告)号：JPH02137241A

公开(公告)日：1990-05-25

申请号：JP21154489

申请日：1989-08-18

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORAA ,  REIMONDO ROBAATO HOOTON ,  FUIRITSUPU MAAFUII ,  MAIKERU JIYON PURAMAA

IPC: H01L21/60 ,  B23K20/02 ,  F16C19/50 ,  H01L21/00

Abstract: PURPOSE: To automatically adjust parallelism of two planes by constituting the rotary axis of two planes so as to rotate these planes around a crossing point while mutually vertically crossing at the point on one plane. CONSTITUTION: A flat face 104 of an X carriage 84 faces a cylindrical projecting face 102. When a pedestal 82 moves so as to press the surface 104 to a flat face 106, the surface 104 changes its direction so as to be parallel with the surface 106. At such a time, when there area axes 98 and 90 within the surface 104, the face 104 is rotated around the axes 98 and 90, and a crossing point 100 does not move vertically to the moving direction of the pedestal 82. Concerning a connector 254 applying this principle, a beam lead wire on a tape 265 is held between a top end part 263 of a bond head and a chip in a chip housing chamber 269 on a fixed table 270, and a connecting pad 30 of an electronic device 24 exists within the plane formed from the crossing point of rotary axes 130 and 152. Thus, satisfactory parallelism can be automatically provided and quality and reliability can be improved in bond connection.

公开(公告)号：JPH0241772A

公开(公告)日：1990-02-09

申请号：JP15597789

申请日：1989-06-20

Applicant: IBM

Inventor： HARII RANDERU BITSUKUFUOODO ,  REIMONDO ROBAATO HOOTON ,  IZUMEIRU SEBUDETO NOOAN ,  MAIKERU JIYON PAAMAA ,  JIYOON CHIYAARUZU JIIZU

IPC: B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34

Abstract: PURPOSE: To achieve the fluxless soldering using no silane by directing the gas having the prescribed momentum sufficient to wet the solder wettable surface with the molten solder of the prescribed temperature and not oxidized toward a mound to cool the molten solder. CONSTITUTION: A solder mound 2 is brought into contact with a surface 8 of an object 4 and a surface 10 of an object 6, and the surfaces 8, 10 are solder- wettable. The gas flow 12 is directed to a heater 14, and the heated gas flow 22 is at the high temperature sufficient to melt the solder mound 2. When the mound 2 is melted, oxides on a solid solder are afloat on the surface of the molten solder, the gas flow 22 is directed to the molten solder, and their momentum breaks the surface oxide in the non-oxidized solder and homogenizes the surface oxide when collided with the afloat oxide. The non-oxidized molten solder is brought into contact with the wettable surfaces 8, 10, and the part is then cooled, and the objects 4, 6 are joined with a solder part 24.

公开(公告)号：JPH04356937A

公开(公告)日：1992-12-10

申请号：JP3667091

申请日：1991-02-07

Applicant: IBM

Inventor： UIRIAMU DEIIN BURUUA ,  KURUTO RUDORUFU GUREEBE ,  REIMONDO ROBAATO HOOTON ,  RINDA KARORIN MASHIYUU ,  IZUMEERU SEBUDETO NOIYAN ,  MAIKERU JIYON PAAMAA ,  SANPASU PURUSHIYOTAMAN ,  DEBITSUDO RII RASU

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

Abstract: PURPOSE: To provide a composition and coating for preventing the generation of electrolytic migration between tape automated bonding(TAB) package leads. CONSTITUTION: A nickel alloy protection coating 15 is applied to an alloy composition or a copper-made current carrying lead 13 containing copper/nickel. Consequently the formation of a dendrite between TAB package leads can be prevented.

公开(公告)号：JPH03296241A

公开(公告)日：1991-12-26

申请号：JP40861690

申请日：1990-12-28

Applicant: IBM

Inventor： BAANAADO HAANANDESU ,  REIMONDO ROBAATO HOOTON ,  ISUMEIRU SEBUDETO NOYAN ,  MAIKERU JIYON PAAMAA

IPC: H01L21/60 ,  B23K20/02 ,  F28F9/20 ,  F28F13/00

Abstract: PURPOSE: To provide a heat-insulating insertion device of high efficiency and low mass by filling the space of two hollow disc members fixed each other with a bonding member, having heat insulating property with plural small thermal conductive particles. CONSTITUTION: A heat shield 150 comprises two hollow disc members 160 and 161, fixed each other with bonding members 162 and 163 having heat insulating property. In the hollow region between disc members 160 and 161, for example, balls 185 of stainless steel are packed. In addition, an air distributor 169 is built in the heat shield 150, and low-temperature air is blown from a cooling air tube 135 into between balls. During operation, flow-out heat from an HAT device 100 heats the bottom part disc member 160, and its heat is transferred to the ball 185. Further, the heat is transferred from the ball 185 to a cooling gas.

公开(公告)号：JPH03173199A

公开(公告)日：1991-07-26

申请号：JP28411490

申请日：1990-10-22

Applicant: IBM

Inventor： MAAKU FUIIRUDEINGU BURETSUGUMA ,  REIMONDO ROBAATO HOOTON ,  ISUMEIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA

IPC: H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: PURPOSE: To obtain a three-dimensional chip package in which mounting density and cooling efficiency are enhanced by bonding a plurality of semiconductor substrates physically, at a part of each thereof, to form an enclosure and passing cooling fluid through the enclosure. CONSTITUTION: Chips 150, 151 are arranged at predetermined indications on chip carriers 101-107. For example, the chips 150, 151 are fixed to one side of the carrier 101 and no chip is mounted on the face A of the carrier 106 and the face B of the carrier 107. A channel 190 is formed between the carriers 104, 105 and a channel 191 formed between the carriers 106, 107. An interconnection of signal and power provided between the carriers can realize high band signal transmission between a processor device and a memory device through connecting parts 135, 136. In order to cool an assembly 100 efficiently, coolant is introduced to the channels 190, 191 and flow-out of liquid or gas coolant from the cooling channel is prevented by means of hermetic seals 175, 176.

公开(公告)号：JPH0685096A

公开(公告)日：1994-03-25

申请号：JP16049093

申请日：1993-06-30

Applicant: IBM

Inventor： REIMONDO ROBAATO HOOTON ,  IZUMEIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA ,  UIRIAMU EDOWAADO PENSU FUOOSU

IPC: H01L23/06 ,  H01L23/14 ,  H01L23/367 ,  H01L23/373 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

Abstract: PURPOSE: To obtain a packaging structure, which is superior in points of shock resistance, electric shielding effect, convection cooling and heat transfer, by a method wherein a high-density lightweight electronic packaging device with a convection cooling function is constituted into a structure, wherein the device is encircled with a cover comprising a permeable material. CONSTITUTION: A packaging material 1, which enables the passing of the air in all directions, has a wide-ranging heat transfer power, a structural holding power and an electrical conductivity and is formed into a spongy structure which is of use as an electric shield, is prepared. In the case where this material 1 is used for a package of a component for signal processing use of an electronic device, an electronic component holding material (insulating thin film) 2 is arranged on the surface of the material 1 and a printed wiring or the like, for example, is provided on the holding material 2 as the component 4 for signal processing use. Some open parts 3 are formed in the insulating thin film 2 to allow to flow the air in the material 1. As a result, the material results in being able to be cooled all the material 1 over.

公开(公告)号：JPH05291363A

公开(公告)日：1993-11-05

申请号：JP34178292

申请日：1992-12-22

Applicant: IBM

Inventor： BERUNARUDO HERUNANDESU ,  REIMONDO ROBAATO HOOTON ,  ISUMAIRU CHIEBUDETO NOYAN ,  MAIKERU JIYON PARUMAA ,  MAAKU BII RITSUTAA

IPC: H01L21/60 ,  B08B3/02 ,  B23K1/018 ,  B26F3/00 ,  H05K13/04

Abstract: PURPOSE: To provide a method and apparatus for removing a wire, bonded between a contact pad of a chip and a contact pad of a substrate by using an alternating flow of a fluid. CONSTITUTION: A nozzle 32 having a plurality of air jets in a cavity in which a chip is housed is arranged on the chip, so as to surround chip contact pads 6, substrate contact pads 10, and wires 4 bonded between the pads 6 and 10. Air flows from the plurality of jets, alternate air currents in the clockwise and counterclockwise directions are generated, a plurality of wires are bent forward and backward, fatigue is generated at contact points between the substrate contact pads and the chip contact pads 6, and the wires 4 are cut at the contact points almost at the same time. The nozzle 32 has holes, and air escapes from the holes. The cut wires 4 are carried out and caught by a filter.

公开(公告)号：JPH05205832A

公开(公告)日：1993-08-13

申请号：JP23899692

申请日：1992-08-15

Applicant: IBM

Inventor： REIMONDO ROBAATO HOOTON ,  ISUMAIRU SEBUDETSUTO NOIAN ,  MAIKERU JIYON PAAMA ,  MAAKU BII RITSUTAA

IPC: H01R24/00 ,  H01R12/62 ,  H01R12/72 ,  H05K3/36 ,  H05K7/02

Abstract: PURPOSE: To connect external wiring conductor patterns to device support conductor patterns. CONSTITUTION: In a mutual connection and mounting technology using the elastomer characteristics, a mounting member 8 catches an edge 5 of a device support planer member 1 having device conductors 3, 4 on the edge 5 in a notch 7. The device conductors 3, 4 are provided on the surface of the mounting member 8 so as to be brought into contact with device conductors 9, 10 in the notch 7, and connected to external wiring conductors 12, 13 on an external wiring planer member 14. A connected conductor of the external wire 14 and the device conductors 9, 10 is on the flexible tape containing the elastomer contact adaptation. The holding force 15 to compress the mounting member 8 and hold the mounting member 8 on the external wiring planer member 14 is provided.