公开(公告)号：JPH03173199A

公开(公告)日：1991-07-26

申请号：JP28411490

申请日：1990-10-22

Applicant: IBM

Inventor： MAAKU FUIIRUDEINGU BURETSUGUMA ,  REIMONDO ROBAATO HOOTON ,  ISUMEIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA

IPC: H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: PURPOSE: To obtain a three-dimensional chip package in which mounting density and cooling efficiency are enhanced by bonding a plurality of semiconductor substrates physically, at a part of each thereof, to form an enclosure and passing cooling fluid through the enclosure. CONSTITUTION: Chips 150, 151 are arranged at predetermined indications on chip carriers 101-107. For example, the chips 150, 151 are fixed to one side of the carrier 101 and no chip is mounted on the face A of the carrier 106 and the face B of the carrier 107. A channel 190 is formed between the carriers 104, 105 and a channel 191 formed between the carriers 106, 107. An interconnection of signal and power provided between the carriers can realize high band signal transmission between a processor device and a memory device through connecting parts 135, 136. In order to cool an assembly 100 efficiently, coolant is introduced to the channels 190, 191 and flow-out of liquid or gas coolant from the cooling channel is prevented by means of hermetic seals 175, 176.