公开(公告)号：DE68914939T2

公开(公告)日：1994-11-10

申请号：DE68914939

申请日：1989-09-21

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  COMITA PAUL BRIAN ,  JACKSON ROBERT LLOYD

IPC: H05K3/40 ,  H01L21/70 ,  H05K3/02 ,  H05K3/22 ,  H05K3/46 ,  B23K26/00

Abstract: Thin-film electrical circuits are interconnected by a process comprising the steps of partially ablating the existing thin-film conductor at the connection point(s) by means of a pulsed laser and then depositing a thin-film metal interconnection over the desired area, which includes the area(s) of the existing thin-film circuit that were exposed to the pulsed laser.

公开(公告)号：DE68914939D1

公开(公告)日：1994-06-01

申请号：DE68914939

申请日：1989-09-21

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  COMITA PAUL BRIAN ,  JACKSON ROBERT LLOYD

IPC: H05K3/40 ,  H01L21/70 ,  H05K3/02 ,  H05K3/22 ,  H05K3/46 ,  B23K26/00

Abstract: Thin-film electrical circuits are interconnected by a process comprising the steps of partially ablating the existing thin-film conductor at the connection point(s) by means of a pulsed laser and then depositing a thin-film metal interconnection over the desired area, which includes the area(s) of the existing thin-film circuit that were exposed to the pulsed laser.