公开(公告)号：BR8404612A

公开(公告)日：1985-08-06

申请号：BR8404612

申请日：1984-09-14

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  HOULE FRANCES ANNE ,  JONES CAROL RUTH

IPC: H05K3/14 ,  C23C16/18 ,  H01L21/28 ,  H01L21/285 ,  C23C14/28

公开(公告)号：ZA846889B

公开(公告)日：1985-04-24

申请号：ZA846889

申请日：1984-09-03

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  HOULE FRANCES ANNE ,  JONES CAROL RUTH

IPC: H05K3/14 ,  C23C16/18 ,  H01L21/28 ,  H01L21/285 ,  C22B ,  C23C

公开(公告)号：DE3473166D1

公开(公告)日：1988-09-08

申请号：DE3473166

申请日：1984-08-29

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  HOULE FRANCES ANNE ,  JONES CAROL RUTH

IPC: H05K3/14 ,  C23C16/18 ,  H01L21/28 ,  H01L21/285 ,  C23C16/48

公开(公告)号：DE3563635D1

公开(公告)日：1988-08-11

申请号：DE3563635

申请日：1985-11-05

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  HOULE FRANCES ANNE ,  JONES CAROL RUTH ,  KOVAC CAROLINE ANN

IPC: C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  C23C18/31 ,  H05K3/18

Abstract: In a method of electrolessly depositing copper on a substrate, a palladium seed pattern is formed by directing light (eg from a laser) at the substrate in the presence of the vapour of a palladium compound, such as palladium (II) bis-(hexafluoroacetylacetonate). The substrate may be first coated with a polymer which is removed by excimer laser irradiation.

公开(公告)号：ZA8406889B

公开(公告)日：1985-04-24

申请号：ZA8406889

申请日：1984-09-03

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  HOULE FRANCES ANNE ,  JONES CAROL RUTH

IPC: H05K3/14 ,  C23C16/18 ,  H01L21/28 ,  H01L21/285 ,  C22B ,  C23C

CPC classification number: C23C16/18 ,  H05K3/146

公开(公告)号：DE68914939T2

公开(公告)日：1994-11-10

申请号：DE68914939

申请日：1989-09-21

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  COMITA PAUL BRIAN ,  JACKSON ROBERT LLOYD

IPC: H05K3/40 ,  H01L21/70 ,  H05K3/02 ,  H05K3/22 ,  H05K3/46 ,  B23K26/00

Abstract: Thin-film electrical circuits are interconnected by a process comprising the steps of partially ablating the existing thin-film conductor at the connection point(s) by means of a pulsed laser and then depositing a thin-film metal interconnection over the desired area, which includes the area(s) of the existing thin-film circuit that were exposed to the pulsed laser.

公开(公告)号：DE68914939D1

公开(公告)日：1994-06-01

申请号：DE68914939

申请日：1989-09-21

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  COMITA PAUL BRIAN ,  JACKSON ROBERT LLOYD

IPC: H05K3/40 ,  H01L21/70 ,  H05K3/02 ,  H05K3/22 ,  H05K3/46 ,  B23K26/00

Abstract: Thin-film electrical circuits are interconnected by a process comprising the steps of partially ablating the existing thin-film conductor at the connection point(s) by means of a pulsed laser and then depositing a thin-film metal interconnection over the desired area, which includes the area(s) of the existing thin-film circuit that were exposed to the pulsed laser.

公开(公告)号：DE3585018D1

公开(公告)日：1992-02-06

申请号：DE3585018

申请日：1985-10-17

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  SRINIVASAN RANGASWAMY

IPC: H05K3/10 ,  C23C18/16 ,  H01L21/48 ,  H05K1/03 ,  H05K3/18 ,  G03F7/004

Abstract: An improved technique is described for the formation of conducting patterns on substrates. This technique has particular utility in the provision of "seeding" layers which are often used as catalysis for electroless deposition of an overlying metal layer. The seed layer is provided by casting a polymer containing a seed constituent onto a substrate, after which the polymer is ablatively photodecomposed by far UV radiation of wavelengths less than 400 nm and sufficient energy fluence to create ablative photodecomposition. This exposes the seed constituent in the polymer in the irradiated areas. Electroless plating of a metal can then occur, the plating being limited to only those areas which have been selectively exposed by the laser irradiation. Thus, a seed layer is prepared by dry processing, in contrast with previous techniques using plating solutions to provide the seed layer.

公开(公告)号：SG43687A1

公开(公告)日：1997-11-14

申请号：SG1995002164

申请日：1993-12-07

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  COMITA PAUL BRIAN ,  CROWDER MARK STEPHEN ,  TYNDALL GEORGE WILLIAM III

IPC: G11B5/72 ,  G11B5/725 ,  G11B5/84 ,  G11B5/60

Abstract: The present invention relates to a process for coating a magnetic recording device with a lubricating polymeric film using an ion beam source. The process comprises the steps of: (i) placing the article in a chamber; (ii) evacuating the chamber; (iii) providing a beam of ions of one sign; (iv) introducing precursor gas into the chamber; and (v) contacting the surface of the article with the beam and the precursor gas to form the polymeric film on the surface of the article.

公开(公告)号：SG30339A1

公开(公告)日：1996-06-01

申请号：SG1995000228

申请日：1995-04-07

Applicant: IBM

Inventor： REIDSEMA CINDY MARIE ,  VARSIK JOSEPH EDWARD ,  MATIENZO LUIS JESUS ,  BAUM THOMAS HALL

IPC: B05D5/12