公开(公告)号：SG43687A1

公开(公告)日：1997-11-14

申请号：SG1995002164

申请日：1993-12-07

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  COMITA PAUL BRIAN ,  CROWDER MARK STEPHEN ,  TYNDALL GEORGE WILLIAM III

IPC: G11B5/72 ,  G11B5/725 ,  G11B5/84 ,  G11B5/60

Abstract: The present invention relates to a process for coating a magnetic recording device with a lubricating polymeric film using an ion beam source. The process comprises the steps of: (i) placing the article in a chamber; (ii) evacuating the chamber; (iii) providing a beam of ions of one sign; (iv) introducing precursor gas into the chamber; and (v) contacting the surface of the article with the beam and the precursor gas to form the polymeric film on the surface of the article.

公开(公告)号：DE68914939T2

公开(公告)日：1994-11-10

申请号：DE68914939

申请日：1989-09-21

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  COMITA PAUL BRIAN ,  JACKSON ROBERT LLOYD

IPC: H05K3/40 ,  H01L21/70 ,  H05K3/02 ,  H05K3/22 ,  H05K3/46 ,  B23K26/00

Abstract: Thin-film electrical circuits are interconnected by a process comprising the steps of partially ablating the existing thin-film conductor at the connection point(s) by means of a pulsed laser and then depositing a thin-film metal interconnection over the desired area, which includes the area(s) of the existing thin-film circuit that were exposed to the pulsed laser.

公开(公告)号：DE68914939D1

公开(公告)日：1994-06-01

申请号：DE68914939

申请日：1989-09-21

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  COMITA PAUL BRIAN ,  JACKSON ROBERT LLOYD

IPC: H05K3/40 ,  H01L21/70 ,  H05K3/02 ,  H05K3/22 ,  H05K3/46 ,  B23K26/00

Abstract: Thin-film electrical circuits are interconnected by a process comprising the steps of partially ablating the existing thin-film conductor at the connection point(s) by means of a pulsed laser and then depositing a thin-film metal interconnection over the desired area, which includes the area(s) of the existing thin-film circuit that were exposed to the pulsed laser.