公开(公告)号：JPH03200333A

公开(公告)日：1991-09-02

申请号：JP6134290

申请日：1990-03-14

Applicant: IBM

Inventor： KIISU FUOURAA BETSUKUHAN ,  DEBUITSUDO KARORU CHIYARENAA ,  ARUNABA GUPUTA ,  JIYOSEFU MASHIYUU HAABUIRUCHIY ,  JIEEMUSU MAAKU RIAZU ,  JIEEMUSU ROBAATO ROIDO ,  DEBUITSUDO KURIFUOODO RONGU ,  HORATEIO KUINONESU ,  KURISHIYUNA SESUHAN ,  MORISU SHIYATSUZUKESU

IPC: B23K26/00 ,  H01L21/3205 ,  H01L21/82 ,  H01L23/52 ,  H01L23/525 ,  H05K3/22

Abstract: PURPOSE: To form an open circuit suitable for use in the line of a semiconductor chip by feeding a DC current to a conductor and heating a selected position to be open-circuited of the conductor. CONSTITUTION: A power supply 34 operates to feed a DC current I through probes 36, 38 and a conductor 28'. When the current I is flowing through the conductor 28', a laser 22 and a focusing mechanism 24 operate to focus laser energy 26 generally onto a region 46 thus elevating the temperature of a conductor thereat. A sensor 40 operates to monitor the resistance in the conductor 28'. Since a DC current I is employed along with local heating of the conductor 28' with laser energy 26, an open circuit is formed surely in the conductor in a relatively short time without substantially damaging the peripheral and underlying structure.