公开(公告)号：JPS61265853A

公开(公告)日：1986-11-25

申请号：JP4427786

申请日：1986-03-03

Applicant: IBM

Inventor： ABUINATSUSHIYU SURIPATSUDO ADO ,  JIYOSEFU MASHIYUU HAABUIRUCHIY ,  JIYOSEFU ROKO RANARI ,  DEEBITSUDO UIRIAMU RITSUCHI

IPC: H01L21/3205 ,  B23K20/233 ,  B23K35/00 ,  C04B41/52 ,  C04B41/89 ,  H01L21/48 ,  H01L21/60 ,  H01R43/16 ,  H05K3/24

公开(公告)号：JPH03200333A

公开(公告)日：1991-09-02

申请号：JP6134290

申请日：1990-03-14

Applicant: IBM

Inventor： KIISU FUOURAA BETSUKUHAN ,  DEBUITSUDO KARORU CHIYARENAA ,  ARUNABA GUPUTA ,  JIYOSEFU MASHIYUU HAABUIRUCHIY ,  JIEEMUSU MAAKU RIAZU ,  JIEEMUSU ROBAATO ROIDO ,  DEBUITSUDO KURIFUOODO RONGU ,  HORATEIO KUINONESU ,  KURISHIYUNA SESUHAN ,  MORISU SHIYATSUZUKESU

IPC: B23K26/00 ,  H01L21/3205 ,  H01L21/82 ,  H01L23/52 ,  H01L23/525 ,  H05K3/22

Abstract: PURPOSE: To form an open circuit suitable for use in the line of a semiconductor chip by feeding a DC current to a conductor and heating a selected position to be open-circuited of the conductor. CONSTITUTION: A power supply 34 operates to feed a DC current I through probes 36, 38 and a conductor 28'. When the current I is flowing through the conductor 28', a laser 22 and a focusing mechanism 24 operate to focus laser energy 26 generally onto a region 46 thus elevating the temperature of a conductor thereat. A sensor 40 operates to monitor the resistance in the conductor 28'. Since a DC current I is employed along with local heating of the conductor 28' with laser energy 26, an open circuit is formed surely in the conductor in a relatively short time without substantially damaging the peripheral and underlying structure.

公开(公告)号：JPH0220049A

公开(公告)日：1990-01-23

申请号：JP12303489

申请日：1989-05-18

Applicant: IBM

Inventor： JIYOSEFU RUISU HOOBUASU ,  ROBAATO GUREN BIISUKUBOON ,  JIYOSEFU MASHIYUU HAABUIRUCHIY

IPC: H01L23/473 ,  H01L23/36 ,  H01L23/40 ,  H01L23/433

Abstract: PURPOSE: To dissipate heat efficiently from a heat generating device without contacting a cooling fluid directly to a chip or a region fixed with the chip by providing a thermally conductive cooling hat for providing a space from a tinned inner heat conduction unit, and a bias means for pressing the inner heat conduction unit against an electronic circuit device. CONSTITUTION: The cooling module for an electronic circuit device comprises a finned inner heat conduction unit 14, a corresponding tinned cooling hat 40, and heat medium 29 exhibiting deformability at the boundary of the inner heat conduction unit and the boundary of corresponding fin of the cooling hat. A unique bias means 20 imparts a balanced force between the inner heat conduction unit 14 and the cooling hat 40 and presses the surface at the flat base 15 of the inner heat conduction unit against a corresponding chip 11 through the heat medium 29. The bias means 20 imparts a balanced load to the boundary of the chip 11 and the tinned inner heat conduction unit 14 and applies a uniform pressure thus producing a corresponding uniform heat flow through a deformable boundary. Preferably, the deformable boundary is an oily film of synthetic oil, for example, excellent in stability and having a relatively high thermal conductivity.