公开(公告)号：JPH01196751A

公开(公告)日：1989-08-08

申请号：JP29113888

申请日：1988-11-19

Applicant: IBM

Inventor： PATORITSUKU KURINTON AANETSUTO ,  JIYON SUCHIYUAATO FUOSUTAA ,  JIEEN ERIZABESU FUROMUMAA ,  UIRIAMU ARUBAATO REINOORUZU JI

IPC: G11B9/00 ,  G11B9/14

Abstract: PURPOSE: To erase the data without damaging a storage surface by selectively sticking molecules to the flat storage surface. CONSTITUTION: A composite leaf spring assembly 13 is a rectangular composite linear spring consisting of main, sub-platforms (P) 12, 14 to control coarse one- dimensional movement in the x direction by a suitable power source 21. The atomically flat storage surface 30 that a deviation from absolute flatness such as graphite, etc., doesn't exceed 25% of the height of the molecule of material stuck to the surface is provided on a suitable substrate. This substrate is attached to an xyz drive 31. The drive 31 is attached to the P 32. When a voltage pulse is applied to a selected probe chip 11, the molecules are stuck from the fruid containing the molecules in contact with the surface to the surface 30 removably. The power source 36 imparts drive force controlling the coarse one-dimensional movement in the y direction to the P 32. The surface 30 can perform large relative movement for the chip 11 by the assembly 13 and a leaf spring assembly 32a. By such a manner, the data are erased without damaging the storage surface.