公开(公告)号：JPH0341449A

公开(公告)日：1991-02-21

申请号：JP15885490

申请日：1990-06-19

Applicant: IBM

Inventor： PATORITSUKU KURINTON AANETSUTO ,  ANDAAZU BURAIANTO ,  JIYON SUCHIYUAATO FUOSUTAA ,  JIYUUN ERIZABESU FUROOMAA ,  JIYON ASAO KARII IWATA

IPC: G01Q60/00 ,  G03F1/00 ,  G03F7/20 ,  H01J37/317 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE: To improve the resolution of a mask by applying a prescribed voltage pulse to a tunnel probe and changing the electric conductivity of the films on a substrate, thereby forming the mask which does not require the removal of the one film varying in the electric conductivity. CONSTITUTION: The film 10 in an amorphous state consisting of GeTe, etc., is formed on the substrate 11 consisting of Si, etc. The electron radiation probe 12 of a scanning type tunnel microscope is then placed within the prescribed tunnel distance of the film 10 and, thereafter, while the probe is moved in an arrow 14 direction, the prescribed voltage pulses (a), (b), (c) dependent upon the thickness of the film 10 are applied between the probe 12 and the film 10 to locally heat the a', b', c' parts of the film 10 and to crystallize these parts by changing their electric conductivity. As a result, the mask 15 which does not require the removal of the amorphous parts is obtd. The mask 15 is used and the voltage pulses are then applied between the mask and the film 16 on the wafer 17 to chemically change the desired parts of the film 16 or to cause the phase change thereof and, thereafter, the film 16 is patterned by executing peeling or etching.

公开(公告)号：JPH0917058A

公开(公告)日：1997-01-17

申请号：JP14745096

申请日：1996-06-10

Applicant: IBM

Inventor： PATORITSUKU KURINTON AANETSUTO ,  DEEBITSUDO AANESUTO KOORU ,  BUREA IAN FUINKERUSHIYUTAIN ,  GUREN ARAN JIYAKETSUTO ,  ERUNESUTO ESUTEBAN MARINEERO

IPC: G11B7/24 ,  G11B7/125 ,  G11B11/10 ,  G11B11/105 ,  G11B20/18

Abstract: PROBLEM TO BE SOLVED: To sufficiently define recording mark edges and to decrease the thermal interference between recording marks of close spacings by modulating a laser among three ways of output levels at the time of forming the recording marks. SOLUTION: The laser 408 is controlled by a processor 404, a memory storage device 406 and a laser driver 500. The laser 408 is optically coupled to optical elements 414 and 416 for directing a light beam 418 onto a disk 402. The light reflected from the disk 402 is detected by a feedback detector 422 coupled to a data detector 420 and laser driver 500 coupled to a processor 404. A starting magnet 424 for generating a magnetic field in a first direction and a bias magnet 426 for generating the magnetic field in a second direction opposite thereto are positioned in proximity to the disk 420. The disk 402 has a substrate 430, at least one reference layer 432 and a memory layer 434.

公开(公告)号：JPH01196751A

公开(公告)日：1989-08-08

申请号：JP29113888

申请日：1988-11-19

Applicant: IBM

Inventor： PATORITSUKU KURINTON AANETSUTO ,  JIYON SUCHIYUAATO FUOSUTAA ,  JIEEN ERIZABESU FUROMUMAA ,  UIRIAMU ARUBAATO REINOORUZU JI

IPC: G11B9/00 ,  G11B9/14

Abstract: PURPOSE: To erase the data without damaging a storage surface by selectively sticking molecules to the flat storage surface. CONSTITUTION: A composite leaf spring assembly 13 is a rectangular composite linear spring consisting of main, sub-platforms (P) 12, 14 to control coarse one- dimensional movement in the x direction by a suitable power source 21. The atomically flat storage surface 30 that a deviation from absolute flatness such as graphite, etc., doesn't exceed 25% of the height of the molecule of material stuck to the surface is provided on a suitable substrate. This substrate is attached to an xyz drive 31. The drive 31 is attached to the P 32. When a voltage pulse is applied to a selected probe chip 11, the molecules are stuck from the fruid containing the molecules in contact with the surface to the surface 30 removably. The power source 36 imparts drive force controlling the coarse one-dimensional movement in the y direction to the P 32. The surface 30 can perform large relative movement for the chip 11 by the assembly 13 and a leaf spring assembly 32a. By such a manner, the data are erased without damaging the storage surface.