公开(公告)号：JPH06107958A

公开(公告)日：1994-04-19

申请号：JP13321593

申请日：1993-06-03

Applicant: IBM

Inventor： ARI AFUZARIIARUDAKANI ,  JIEFURII TEII GOTOROO ,  JIEFURII SHII HEDORITSUKU ,  KONSUTANTEINOSU PAPATOMASU ,  NIRANJIYAN EMU PATERU ,  JIEIN EMU SHIYOO ,  ARUFURETSUDO BIIBETSUKU

IPC: B32B27/06 ,  C08G65/40 ,  C08G73/06 ,  C08G75/00 ,  C08G75/20 ,  C08G79/02 ,  C08G79/04 ,  C08J5/24 ,  C08L79/04 ,  C08L101/00 ,  C08L101/02 ,  C08L101/04 ,  H05K1/03

Abstract: A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.