公开(公告)号：JPH09103732A

公开(公告)日：1997-04-22

申请号：JP23449696

申请日：1996-09-04

Applicant: IBM

Inventor： ERIZABESU FUOSUTAA ,  JIEFURII SHII HEDORITSUKU ,  ROBAATO EMU JIYATSUPU ,  KONSUTANTEINOSU PAPATOMASU ,  SUTEFUAN ERU TEISUDEERU ,  ARUFURETSUDO BUIIBETSUKU

IPC: B05C11/10 ,  B05C5/02 ,  B05C5/04 ,  B29B15/12

Abstract: PROBLEM TO BE SOLVED: To precisely and easily supply a fluid to a substrate by providing a head member having plural fluid injectors and a means for controlling the amt. of the fluid to be supplied to a workpiece. SOLUTION: Two parallel head members 11 and 11' each having plural fluid injectors are provided with the means 23 and 23' to seal the second fluids 25 and 25' at a second pressure almost equal to or higher than the pressure of the first fluids 15 and 15'. The first fluids 15 and 15', e.g. an epoxy resin soln., are supplied to the specified positions 17 and 17' on a glass substrate 19 as the workpiece. Namely, the substrate 19 is coated with the fluids before being used as the material for a printed circuit board. At this time, the second fluids 25 and 25', e.g. nitrogen, are supplied to the specified positions 17 and 17' to limit the first fluids 15 and 15' and collided with almost the central position of the feeder 10. The fluids are supplied to the substrate 19 precisely and easily in this way.

公开(公告)号：JPH0782490A

公开(公告)日：1995-03-28

申请号：JP21315194

申请日：1994-08-15

Applicant: IBM

Inventor： JIEFURII TOMASU GOTOROO ,  JIEFURII KAACHISU HEDORITSUKU ,  KONSUTANTEINOSU PAPATOMASU ,  NIRANJIYAN MOOHANRAARU PATERU ,  ARUFURETSUDO BUIIBETSUKU ,  UIRIAMU JIYOOZEFU

IPC: C08L27/12 ,  C08G59/30 ,  C08L63/00 ,  C08L71/00 ,  C08L71/08 ,  C08L71/10 ,  C08L87/00 ,  C08L101/00 ,  C08L101/02 ,  H05K1/03

公开(公告)号：JPH06107958A

公开(公告)日：1994-04-19

申请号：JP13321593

申请日：1993-06-03

Applicant: IBM

Inventor： ARI AFUZARIIARUDAKANI ,  JIEFURII TEII GOTOROO ,  JIEFURII SHII HEDORITSUKU ,  KONSUTANTEINOSU PAPATOMASU ,  NIRANJIYAN EMU PATERU ,  JIEIN EMU SHIYOO ,  ARUFURETSUDO BIIBETSUKU

IPC: B32B27/06 ,  C08G65/40 ,  C08G73/06 ,  C08G75/00 ,  C08G75/20 ,  C08G79/02 ,  C08G79/04 ,  C08J5/24 ,  C08L79/04 ,  C08L101/00 ,  C08L101/02 ,  C08L101/04 ,  H05K1/03

Abstract: A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

公开(公告)号：JPH05163467A

公开(公告)日：1993-06-29

申请号：JP28959691

申请日：1991-11-06

Applicant: IBM

Inventor： CHIYAARUZU ROBAATO DEIBISU ,  ASHITO AABINDO MEETA ,  KONSUTANTEINOSU PAPATOMASU ,  RII POORU SUPURINGAA ,  UIRIAMU JIYOZEFU SUMA ,  DEIBITSUDO UEI WAN

IPC: C09J7/02 ,  C09J163/00 ,  C09J163/02 ,  C09J179/00 ,  C09J179/04 ,  H01L23/12 ,  H01L23/14 ,  H05K3/38 ,  H05K3/46