公开(公告)号：JPH08339511A

公开(公告)日：1996-12-24

申请号：JP13693196

申请日：1996-05-30

Applicant: IBM

Inventor： JIEFURII UIRIAMU KAA ,  JIEFURII POORU GANDAA

IPC: G11B5/10 ,  G11B5/127 ,  G11B5/255 ,  G11B5/31 ,  G11B5/39 ,  G11B5/60 ,  G11B21/21

Abstract: PROBLEM TO BE SOLVED: To obtain a composite thin-film slider, which is projected onto a substrate, by which a magnetic space between a read/write(R/W) device and a recording medium is reduced, and which has the projecting-shaped R/W device formed by chemical-mechanical polishing. SOLUTION: A slider has a substrate 502 and a R/W device 504, and the R/W device further has an insulator 600 and various conductive R/W components 605. These components consist of multiple shields 601, 602, an MR band 603 and a polar chip 604. The slider has an approximately uniform film (such as the layer of a carbon base) covering the substrate and the R/W device for protection from abrasion, contamination, damage, etc. The front section of the R/W device can also be thinned and removed as required. The R/W device is projected to a section upper than the extended surface of the bearing surface of the substrate, and the R/W device can be brought extremely near to a recording medium at the time of the operation of the slider.

公开(公告)号：JPH02278822A

公开(公告)日：1990-11-15

申请号：JP5391490

申请日：1990-03-07

Applicant: IBM

Inventor： JIEFURII UIRIAMU KAA ,  ROORENSU DANIERU DEBUIDO ,  UIRIAMU REZURIII GASURIII ,  FURANKU BENJIYAMIN KAAFUMAN ,  UIRIAMU JIYON PATORITSUKU ,  KENESU PAAKAA ROTSUDOBERU ,  ROBAATO UIRIAMU PASUKO ,  ANTON NENADEITSUKU

IPC: B24B37/00 ,  C09G1/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/48

Abstract: PURPOSE: To provide an allowable flat substrate surface by contacting a substrate which has etching speed different from that of specified etching liquid with a polishing pad and contacting that substrate with a slurry containing the etching liquid composed of abradant particles, chelate salt of transient metal and its solvent. CONSTITUTION: Concerning an electronic part substrate having two characteristics such as a ceramic substrate having metal bias, for example, having the etching speed different from that of specified etching liquid, this substrate is contacted with the polishing pad, contacted with the slurry containing the specified etching liquid, and planarized by chemical/mechanical polishing. This slurry is composed of the abradant particles, chelate salt of transient metal and solvent for this salt, the chelate salt of transient metal exerts chemical operation or etching operation upon the solvent, and the abradant particles exert mechanical operation in cooperation with the polishing pad. Thus, the substrate surface can be almost planarized.