公开(公告)号：JPH08238564A

公开(公告)日：1996-09-17

申请号：JP33624895

申请日：1995-12-25

Applicant: IBM

Inventor： MAIKERU ANSONII GEINZU ,  KOSUTASU PAPATOMASU ,  JIINA EMU FUERAN ,  CHIYAARUZU JIERAADO UOICHIKU

IPC: B23K1/00 ,  B23K1/20 ,  B23K20/02 ,  B23K35/00 ,  B23K35/02 ,  B23K35/30 ,  H01B1/22 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide a metallurgical bond reliable in the bulk of a low temp. electrically conductive adhesion. SOLUTION: A metallurgical bond substituted for a soldering process is obtd. by forming an alloy X of a substrate metal S composed of noble metal and a metallic coating of indium, tin or lead applied to at least one of the surfaces to be bonded by a transient liq. phase(TLP) reaction at a low temp. The surfaces to be bonded are put side by side via a polymer adhesive contg. conductive particles, and, before the start of the TLP process, the polymer adhesive cured at the temp. lower than the m.p. of the eutectic alloy of the chosen metal system, by which compressive force produces between the surfaces, and the alloying thereof is made easy. Moreover, in the process of the heat cycle at low temps., a metallurgical bond high in mechanical strength and resistance stability can be formed.