公开(公告)号：JPH0750454A

公开(公告)日：1995-02-21

申请号：JP11667394

申请日：1994-05-30

Applicant: IBM

Inventor： ROURENSU RICHIYAADO KATSUTEING ,  MAIKERU ANSONII GEINZU ,  ERITSUKU AASAA JIYONSON ,  SHINSHIA SUUZAN MIRUKOBITSUCHI ,  JIEFUREI SUKOTSUTO PAAKINSU ,  MAAKU BINSENTO PIASON ,  SUTEIIBUN YUUJIIN PETSUTSUINGA ,  JIYAAJII ENU EMU ENU ZARESHINS

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

Abstract: PURPOSE: To enhance thermal operation of a flexible circuit board mounted with components on the opposite sides thereof by folding the circuit board around one line at a thin part, without folding the thick part thereof. CONSTITUTION: A dielectric film 202 is covered, on the opposite sides thereof, with adhesive layers 204, 206 to form a base board. Each adhesive layer is covered, on the outer surface thereof, with a patterned metal layer 208, 210 to produce a two layer circuit board. Each patterned metallic layer 208, 210 is then covered, on the outer surface thereof, with another adhesive layer 212, 214 and another dielectric layer 216, 218. Subsequently, the entire structure is hot pressed. Finally, thick and hard regions 240, 242 and 244, where a wiring layer and a dielectric layer are spread additionally, are formed along with thin flexible regions 246, 248, where the circuit board can be folded around one line without folding the hard region.

公开(公告)号：JPH08238564A

公开(公告)日：1996-09-17

申请号：JP33624895

申请日：1995-12-25

Applicant: IBM

Inventor： MAIKERU ANSONII GEINZU ,  KOSUTASU PAPATOMASU ,  JIINA EMU FUERAN ,  CHIYAARUZU JIERAADO UOICHIKU

IPC: B23K1/00 ,  B23K1/20 ,  B23K20/02 ,  B23K35/00 ,  B23K35/02 ,  B23K35/30 ,  H01B1/22 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide a metallurgical bond reliable in the bulk of a low temp. electrically conductive adhesion. SOLUTION: A metallurgical bond substituted for a soldering process is obtd. by forming an alloy X of a substrate metal S composed of noble metal and a metallic coating of indium, tin or lead applied to at least one of the surfaces to be bonded by a transient liq. phase(TLP) reaction at a low temp. The surfaces to be bonded are put side by side via a polymer adhesive contg. conductive particles, and, before the start of the TLP process, the polymer adhesive cured at the temp. lower than the m.p. of the eutectic alloy of the chosen metal system, by which compressive force produces between the surfaces, and the alloying thereof is made easy. Moreover, in the process of the heat cycle at low temps., a metallurgical bond high in mechanical strength and resistance stability can be formed.

公开(公告)号：JPH0831995A

公开(公告)日：1996-02-02

申请号：JP15137695

申请日：1995-06-19

Applicant: IBM

Inventor： TOOMASU MORAN KARUNEEN ,  MAIKERU ANSONII GEINZU ,  PINGU UONGU SETO ,  HASAIN SHIYAUKATSURUA

IPC: H01L23/40 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42

Abstract: PURPOSE: To provide a method of realizing a high density element by improved reliability and increased power consumption by improving radiation efficiency from a flip chip. CONSTITUTION: A heatsink 118 of A1 or copper is mounted on a ceramic cap 100 or on an exposure semiconductor chip 102 by using flexible epoxi 120 so as to improve radiation efficiency. The A1 is covered either with an anode oxide film or chrominium acid salt conversion and copper is covered with nickel. Such a structure is useful for mounting of a flip-chip on a flexible or hard organic material circuit substrate and for formation of a chip carrier package of CQFP, CBGA or others. These adhesives bear a heat cycle test of 300 times at -40 deg.C to 140 deg.C and having no strength drop in spite of continuous exposure of 1000 hours at 130 deg.C. Epoxy has an elasticity coefficient of less than 10 psi and a glass transfer point of less 25 deg.C being very strong and not contaminating the module and the substrate and having a thermal expansion coefficient between a die and a radiator metal.