公开(公告)号：JPH05216242A

公开(公告)日：1993-08-27

申请号：JP23436692

申请日：1992-09-02

Applicant: IBM

Inventor： NAGESHIYUWAA RAO BANTOU ,  ANIRUKUMARU CHINUPURASADO BATS ,  ASHIYUUINKUMARU CHINUPURASADO ,  JIYOZEFU ARUFUONSU KOTEIRO ,  JIERARUDO UOORUTAA JIYOONZU ,  ROBAATO JIYON OUIN ,  KOSUTASU PAPATOMASU ,  ANAAYA KUMARU BARUDOYA

IPC: G03F7/32 ,  G03F7/42 ,  H05K3/06

Abstract: PURPOSE: To provide a developer and a stripping agent simple, adaptable to environment and for a free radical initiating and addition polymerizing photoresist, a cationic hardened resist and a soldering mask and a Vacrel photoresist. CONSTITUTION: Both of the developer and the stripping agent in all cases contain τ-butylolactone, propylene carbonate and benzyl alcohol and optionally contains a small quantity of methanol, ethanol, isopropyl, propylene glycol monomethyl acetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, methylethyl ketone, acetone and water.

公开(公告)号：JPH08238564A

公开(公告)日：1996-09-17

申请号：JP33624895

申请日：1995-12-25

Applicant: IBM

Inventor： MAIKERU ANSONII GEINZU ,  KOSUTASU PAPATOMASU ,  JIINA EMU FUERAN ,  CHIYAARUZU JIERAADO UOICHIKU

IPC: B23K1/00 ,  B23K1/20 ,  B23K20/02 ,  B23K35/00 ,  B23K35/02 ,  B23K35/30 ,  H01B1/22 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide a metallurgical bond reliable in the bulk of a low temp. electrically conductive adhesion. SOLUTION: A metallurgical bond substituted for a soldering process is obtd. by forming an alloy X of a substrate metal S composed of noble metal and a metallic coating of indium, tin or lead applied to at least one of the surfaces to be bonded by a transient liq. phase(TLP) reaction at a low temp. The surfaces to be bonded are put side by side via a polymer adhesive contg. conductive particles, and, before the start of the TLP process, the polymer adhesive cured at the temp. lower than the m.p. of the eutectic alloy of the chosen metal system, by which compressive force produces between the surfaces, and the alloying thereof is made easy. Moreover, in the process of the heat cycle at low temps., a metallurgical bond high in mechanical strength and resistance stability can be formed.

公开(公告)号：JPH07188391A

公开(公告)日：1995-07-25

申请号：JP23124994

申请日：1994-09-27

Applicant: IBM

Inventor： ROI RIN ARURITSUTO ,  KURISUCHIINA MARII BOIKO ,  BAATORAN JIYOO KEISON ,  RICHIYAADO MAIKERU KOZUROUSUKI ,  JIYOSEFU DEYUAN KURESUZA ,  JIYON MASHIYUU ROOFUAA ,  FUIRITSUPU CHISHIYOO RIYUU ,  BUOYA RISUTA MARUKOBUICHI ,  ISUSA SAIDO MAUMUUDO ,  JIEEMUSU FURANSHISU MUSUKA ,  KOSUTASU PAPATOMASU ,  JIYOSEFU JIIN SABIA ,  RICHIYAADO ANSONII SHIYUUMATSU

IPC: B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40

公开(公告)号：JPH05140352A

公开(公告)日：1993-06-08

申请号：JP16283491

申请日：1991-07-03

Applicant: IBM

Inventor： MAIKERU JIYOZEFU CHIBURUSUKII ,  KOSUTASU PAPATOMASU ,  JIYOOJI PAASHINGU SHIYUMITSUTO

IPC: C08G59/18 ,  C08G59/40 ,  C08J3/24 ,  C08J5/24 ,  H05K3/02

公开(公告)号：JPH05239180A

公开(公告)日：1993-09-17

申请号：JP17509492

申请日：1992-07-02

Applicant: IBM

Inventor： FUREDERITSUKU RICHIYAADO KURIS ,  KOSUTASU PAPATOMASU ,  DEIBITSUDO UEI WAN

IPC: C08G18/76 ,  C08G73/06 ,  C08L79/04 ,  C09J175/00 ,  C09J175/04 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29