公开(公告)号：JPH07188391A

公开(公告)日：1995-07-25

申请号：JP23124994

申请日：1994-09-27

Applicant: IBM

Inventor： ROI RIN ARURITSUTO ,  KURISUCHIINA MARII BOIKO ,  BAATORAN JIYOO KEISON ,  RICHIYAADO MAIKERU KOZUROUSUKI ,  JIYOSEFU DEYUAN KURESUZA ,  JIYON MASHIYUU ROOFUAA ,  FUIRITSUPU CHISHIYOO RIYUU ,  BUOYA RISUTA MARUKOBUICHI ,  ISUSA SAIDO MAUMUUDO ,  JIEEMUSU FURANSHISU MUSUKA ,  KOSUTASU PAPATOMASU ,  JIYOSEFU JIIN SABIA ,  RICHIYAADO ANSONII SHIYUUMATSU

IPC: B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40

公开(公告)号：JPH06169177A

公开(公告)日：1994-06-14

申请号：JP23899592

申请日：1992-08-15

Applicant: IBM

Inventor： BAATORAN JIYOU KEISON ,  JIYON AASAA KABAATO ,  SUTEIIBUN AREN DANKAN ,  JIYON MASHIYUU ROOFUAA ,  ISA SAAIDO MAAMUUDO ,  RICHIYAADO ANSONII SHIYUUMAASH

IPC: H05K3/22 ,  H01L21/48 ,  H05K3/46

Abstract: PURPOSE: To inexpensively change and repair a constitution by stacking an isometric polymer dielectric coat layer, a conductive circuit part and top part isometric polymer dielectric film on the surface of a panel and curing the stacked layers. CONSTITUTION: A conductive circuit part structure 51 includes a pair of terminators, such as circular lands 53A, 53B stacked on panel lands 31A, 31B and the lands 53A, 53B include contact parts covered with a conductive wire 55. The wire 55 is stacked on the surface of an isometric polymer dielectric layer 57 and covered with a top part isometric polymer dielectric layer 59, and a dielectric layer is adhered to the structure of the lower layer, so that plural intersecting conductive circuit part wires 51 of which wiring is changed can be superposed on each other. Thereby the constitution can be changed inexpensively and repaired, and the wiring can be changed simply and surely.