公开(公告)号：JPH07188391A

公开(公告)日：1995-07-25

申请号：JP23124994

申请日：1994-09-27

Applicant: IBM

Inventor： ROI RIN ARURITSUTO ,  KURISUCHIINA MARII BOIKO ,  BAATORAN JIYOO KEISON ,  RICHIYAADO MAIKERU KOZUROUSUKI ,  JIYOSEFU DEYUAN KURESUZA ,  JIYON MASHIYUU ROOFUAA ,  FUIRITSUPU CHISHIYOO RIYUU ,  BUOYA RISUTA MARUKOBUICHI ,  ISUSA SAIDO MAUMUUDO ,  JIEEMUSU FURANSHISU MUSUKA ,  KOSUTASU PAPATOMASU ,  JIYOSEFU JIIN SABIA ,  RICHIYAADO ANSONII SHIYUUMATSU

IPC: B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40

公开(公告)号：JPH04233258A

公开(公告)日：1992-08-21

申请号：JP13600691

申请日：1991-05-10

Applicant: IBM

Inventor： JIYON MASHIYUU RAUFUAA ,  RICHIYAADO ANSONII SHIYUUMATSU

IPC: H01L23/34 ,  H01L23/14 ,  H01L23/50 ,  H01L25/16 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: PURPOSE: To increase the surface area of a package which can be used for an active circuit (logic and/or memory) chip and a module, and improve the packing density of a package. CONSTITUTION: This very small-sized electronic circuit package has at least a power core means 11 and signal core means 15, 18. The power core means 11 is manufactured by using a material which has high electric conductivity, high thermal conductivity and high specific heat, and has a function of cooling the package. Thereby an external heat sink is dispersed with.