公开(公告)号：JPH05191042A

公开(公告)日：1993-07-30

申请号：JP15540292

申请日：1992-06-15

Applicant: IBM

Inventor： JIYON METSUDO BURAUAA ,  FUREDERITSUKU RICHIYAADO KURIS ,  UIRIAMU HOUERU ROORENSU ,  ASHITO AABUINDO MEFUTA ,  JIYONASAN DEIBUITSUDO REIDO ,  UIRIAMU JIYOZEFU SUMA

IPC: C08G61/02 ,  C23C14/12 ,  H01L23/14 ,  H05K1/05 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44

Abstract: PURPOSE: To form a hole and passage which is more uniform than that formed in a conventional method by aligning a through-hole with a passage with high precision in a multilayer electronic circuit package, having at least one layer of wired and high molecular encapsulated metallic core. CONSTITUTION: A metallic foil is provided to a metallic core (A), and a hole is formed at the metallic foil (A'). Adhesion-promoting agent is applied to the metallic foil with the hole for adhering a polymer to a metallic foil (B). A dielectric polymer capable of thermal processing or a precursor is vapor deposited (C) on the exposed surface of the metallic foil with the hole, including the inside wall of the hole. When the dielectric polymer is thermally processed, a uniform conformal coating is formed on the surface of the metallic foil with a hole (D). Afterwards, metallization and wiring are done, and lamination onto another layer is made (E).