公开(公告)号：JPH0661303A

公开(公告)日：1994-03-04

申请号：JP4082191

申请日：1991-02-14

Applicant: IBM

Inventor： FUREDERITSUKU RICHIYAADO KURIS ,  KOSUTASU AI PAPATOMASU ,  DEIBITSUDO UEI WAN

IPC: H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34

Abstract: PURPOSE: To form a mutual solder bond connection showing an improved fatigue life and stability by hardening a compsn. of an alicyclic epoxide or hardening cyanate ester or its prepolymer with a binder. CONSTITUTION: A binder has a viscosity of about 1000 centipoises or less at the room temp. A filler has a max. grain size of 31 microns and substantially no α-particle radiation. The binder content (of an epoxy and/or cyanate ester) is about 60-25 wt.% of the sum of the binder and filler. This compsn. is filled in a gap between a chip carrier 2 and semiconductor chip 1 soldered thereto through solder bumps 3 and hardened. As the result, a substantially gapless seal with sounder bonds is realized to ensure a highly reliable device and increase the fatigue life of the mutual solder bond.

公开(公告)号：JPH05191042A

公开(公告)日：1993-07-30

申请号：JP15540292

申请日：1992-06-15

Applicant: IBM

Inventor： JIYON METSUDO BURAUAA ,  FUREDERITSUKU RICHIYAADO KURIS ,  UIRIAMU HOUERU ROORENSU ,  ASHITO AABUINDO MEFUTA ,  JIYONASAN DEIBUITSUDO REIDO ,  UIRIAMU JIYOZEFU SUMA

IPC: C08G61/02 ,  C23C14/12 ,  H01L23/14 ,  H05K1/05 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44

Abstract: PURPOSE: To form a hole and passage which is more uniform than that formed in a conventional method by aligning a through-hole with a passage with high precision in a multilayer electronic circuit package, having at least one layer of wired and high molecular encapsulated metallic core. CONSTITUTION: A metallic foil is provided to a metallic core (A), and a hole is formed at the metallic foil (A'). Adhesion-promoting agent is applied to the metallic foil with the hole for adhering a polymer to a metallic foil (B). A dielectric polymer capable of thermal processing or a precursor is vapor deposited (C) on the exposed surface of the metallic foil with the hole, including the inside wall of the hole. When the dielectric polymer is thermally processed, a uniform conformal coating is formed on the surface of the metallic foil with a hole (D). Afterwards, metallization and wiring are done, and lamination onto another layer is made (E).

公开(公告)号：JPH05239180A

公开(公告)日：1993-09-17

申请号：JP17509492

申请日：1992-07-02

Applicant: IBM

Inventor： FUREDERITSUKU RICHIYAADO KURIS ,  KOSUTASU PAPATOMASU ,  DEIBITSUDO UEI WAN

IPC: C08G18/76 ,  C08G73/06 ,  C08L79/04 ,  C09J175/00 ,  C09J175/04 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29