公开(公告)号：JPH07221443A

公开(公告)日：1995-08-18

申请号：JP31639194

申请日：1994-12-20

Applicant: IBM

Inventor： RISA JIININ JIMARETSUTSU ,  UIRIAMU HOUERU ROORENSU ,  BUOYA RISUTA MARUKOBUITSUCHI ,  ROBAATO JIYON OUEN ,  KARUROSU JIEI SANBASETSUCHI

IPC: C23C18/28 ,  C23C18/22 ,  C23C18/31 ,  H05K3/18 ,  H05K3/38

Abstract: PURPOSE: To increase a seeding or activation efficiency of dielectric material for electroless plating to be conducted afterward by depositing conductive metal on the surface of a dielectric substrate using a metal sheet having specific parameters and a rough surface. CONSTITUTION: This method includes a step for obtaining a metal sheet having a rough surface and parameters including Ra=0.00127-0.00203 mm, Rmax=0.00508-0.0140 mm, Sm=0.0254-0.0762 mm, Rp=0.00508-0.00889 mm, and a surface area = 0.000581-0.000774 mm , where Ra is an average roughness, that is, an arithmetical mean of the deviations from a horizontal mean line profile, Rmax is the maximum height from the bottom to the top, Sm is a mean distance on the mean line between high points, Rp is the maximum profile height from the mean line, and the surface area is an area under a surface profile. These values are measured by a TalysurfS-120 Profilometer.

公开(公告)号：JPH05191042A

公开(公告)日：1993-07-30

申请号：JP15540292

申请日：1992-06-15

Applicant: IBM

Inventor： JIYON METSUDO BURAUAA ,  FUREDERITSUKU RICHIYAADO KURIS ,  UIRIAMU HOUERU ROORENSU ,  ASHITO AABUINDO MEFUTA ,  JIYONASAN DEIBUITSUDO REIDO ,  UIRIAMU JIYOZEFU SUMA

IPC: C08G61/02 ,  C23C14/12 ,  H01L23/14 ,  H05K1/05 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44

Abstract: PURPOSE: To form a hole and passage which is more uniform than that formed in a conventional method by aligning a through-hole with a passage with high precision in a multilayer electronic circuit package, having at least one layer of wired and high molecular encapsulated metallic core. CONSTITUTION: A metallic foil is provided to a metallic core (A), and a hole is formed at the metallic foil (A'). Adhesion-promoting agent is applied to the metallic foil with the hole for adhering a polymer to a metallic foil (B). A dielectric polymer capable of thermal processing or a precursor is vapor deposited (C) on the exposed surface of the metallic foil with the hole, including the inside wall of the hole. When the dielectric polymer is thermally processed, a uniform conformal coating is formed on the surface of the metallic foil with a hole (D). Afterwards, metallization and wiring are done, and lamination onto another layer is made (E).