公开(公告)号：JPS52112277A

公开(公告)日：1977-09-20

申请号：JP2616877

申请日：1977-03-11

Applicant: IBM

Inventor： JIYOSEFU FUNARI

IPC: B23K11/00 ,  B23K20/00 ,  H01L21/60

公开(公告)号：JPH0637142A

公开(公告)日：1994-02-10

申请号：JP11169693

申请日：1993-05-13

Applicant: IBM

Inventor： JIYOSEFU JIYOOJI AMIIN ,  JIYOSEFU FUNARI ,  RONARUDO JIEEMUSU MUUA

IPC: H01L21/60 ,  B23K1/20 ,  B23K3/06 ,  H01L21/48 ,  H05K3/24 ,  H05K3/34

Abstract: PURPOSE: To provide a method for allowing a regulated amount of solder to stick accurately to a high-density circuit pattern on a substrate, without using a solder mask. CONSTITUTION: First, a solder paste 21 is filled in an accurately regulated transfer member 11 (for example, a graphite block having a hole 17 opened with a drill), then the transfer member 11 is aligned in position with a substrate circuit. When both a block 13 and a substrate 25 are heated, flowing-out and sticking of solder occur without a mask, etc. Following the sticking, a second circuit member (for example, a flexible circuit) is combined electrically to a substrate conductor, and the stuck solder works as a combination medium. Hydrogen gas is used while the paste 21 is heated, and the flexible circuit is soldered to the substrate 25.

公开(公告)号：JPH04234157A

公开(公告)日：1992-08-21

申请号：JP21422291

申请日：1991-08-01

Applicant: IBM

Inventor： MORISU ANSHIERU ,  HOSE AGUSUCHIN BAABOSA ,  ERITSUKU POORU DEITSUBURU ,  JIYOSEFU FUNARI ,  JIYON SUTEIIBUN KURESUGE ,  CHIYAARUZU ROBAATO RAMU ,  RICHIYAADO JIERARUDO MAAFUII ,  SUKOTSUTO DEBITSUDO RENORUZU ,  BAAGATSUTO GAAREBU SAMAKIA ,  TAAMAA ARAN SHIYORUTSU ,  UEIN RATSUSERU SUTOORU JIYUNIA

IPC: H01L23/36 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18

Abstract: PURPOSE: To provide an ultra-compact electronic package that is suited for a high memory capacity and a high memory density, and to use a double-sided surface-mount technology assembly additionally. CONSTITUTION: A package 1 contains a plurality of IC memory chips 11 that are adhered to a circuited flexible tape substrate 21, and the circuited flexible tape substrate 21 is adhered to a printed circuit board 31 later. The circuited flexible tape substrate 21 is extended outward from the printed circuit board 31 and has a plurality of IC memory chips 11 mounted to an I/O pad on it. Each IC memory chip 11 is in contact with a heat sink means 41 on a surface that is opposite to the flexible tape substrate 21. The flexible tape substrate 21 and the heat sink means 41 are joined to the printed circuit board 31.