公开(公告)号：JPH02173129A

公开(公告)日：1990-07-04

申请号：JP27620489

申请日：1989-10-25

Applicant: IBM

Inventor： MORISU ANSHIERU ,  UOORUTAA POORU PAUROUSUKII

IPC: C08J7/12 ,  C08J7/14 ,  C08L79/08 ,  C23C14/02 ,  C23C14/20 ,  H05K3/38

公开(公告)号：JPH0247257A

公开(公告)日：1990-02-16

申请号：JP14130589

申请日：1989-06-05

Applicant: IBM

Inventor： MORISU ANSHIERU

IPC: C23C14/14 ,  C23C14/18 ,  C23C14/20 ,  H01L23/12 ,  H05K3/24 ,  H05K3/38

公开(公告)号：JPH04234157A

公开(公告)日：1992-08-21

申请号：JP21422291

申请日：1991-08-01

Applicant: IBM

Inventor： MORISU ANSHIERU ,  HOSE AGUSUCHIN BAABOSA ,  ERITSUKU POORU DEITSUBURU ,  JIYOSEFU FUNARI ,  JIYON SUTEIIBUN KURESUGE ,  CHIYAARUZU ROBAATO RAMU ,  RICHIYAADO JIERARUDO MAAFUII ,  SUKOTSUTO DEBITSUDO RENORUZU ,  BAAGATSUTO GAAREBU SAMAKIA ,  TAAMAA ARAN SHIYORUTSU ,  UEIN RATSUSERU SUTOORU JIYUNIA

IPC: H01L23/36 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18

Abstract: PURPOSE: To provide an ultra-compact electronic package that is suited for a high memory capacity and a high memory density, and to use a double-sided surface-mount technology assembly additionally. CONSTITUTION: A package 1 contains a plurality of IC memory chips 11 that are adhered to a circuited flexible tape substrate 21, and the circuited flexible tape substrate 21 is adhered to a printed circuit board 31 later. The circuited flexible tape substrate 21 is extended outward from the printed circuit board 31 and has a plurality of IC memory chips 11 mounted to an I/O pad on it. Each IC memory chip 11 is in contact with a heat sink means 41 on a surface that is opposite to the flexible tape substrate 21. The flexible tape substrate 21 and the heat sink means 41 are joined to the printed circuit board 31.