公开(公告)号：GB2548726A

公开(公告)日：2017-09-27

申请号：GB201707907

申请日：2015-10-19

Applicant: IBM

Inventor： JEFFREY GELORME ,  LI-WEN HUNG ,  PAUL ANDRY ,  CORNELIA KANG-I TSANG ,  JOHN KNICKER-BOCKER ,  ROBERT DAVID ALLEN

IPC: H01L21/683

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.