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公开(公告)号：DE3761865D1
公开(公告)日：1990-04-12
申请号：DE3761865
申请日：1987-02-03
Applicant: IBM
Inventor： JOSEPH CHARLES ARNOLD , PETROZELLO JAMES RALPH
IPC: C04B26/14 , C08G59/00 , C08G59/18 , C08G59/20 , C08G59/32 , C08G59/40 , C08G59/62 , C08G59/68 , C08K3/08 , C08L63/00 , G03C1/00 , G03F7/004 , H01B1/22 , H05K3/32 , H01L21/60 , H01R4/04
Abstract: An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electrically conductive bond between a supporting substrate and a semiconductor.
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公开(公告)号：ES2092216T3
公开(公告)日：1996-11-16
申请号：ES93201907
申请日：1993-07-01
Applicant: IBM
IPC: H01L21/56 , H01L21/60 , H01L23/12 , H01L21/52 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/50 , H01L21/58
Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 69.10 N/m . As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.
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公开(公告)号：DE3160606D1
公开(公告)日：1983-08-25
申请号：DE3160606
申请日：1981-01-08
Applicant: IBM
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Patent Agency Ranking
公开(公告)号：DE69305012T2
公开(公告)日：1997-04-03
申请号：DE69305012
申请日：1993-07-01
Applicant: IBM
IPC: H01L21/56 , H01L21/60 , H01L23/12 , H01L21/52 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/50 , H01L21/58
Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 69.10 N/m . As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.
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公开(公告)号：AT143529T
公开(公告)日：1996-10-15
申请号：AT93201907
申请日：1993-07-01
Applicant: IBM
IPC: H01L21/52 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/50 , H01L21/58
Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 69.10 N/m . As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.
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公开(公告)号：CA2091910C
公开(公告)日：1996-07-30
申请号：CA2091910
申请日：1993-03-18
Applicant: IBM
IPC: H01L21/52 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/50 , H01L23/498
Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 10,000 psi. As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.
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公开(公告)号：SG44362A1
公开(公告)日：1997-12-19
申请号：SG1995002312
申请日：1993-07-01
Applicant: IBM
IPC: H01L21/56 , H01L21/60 , H01L23/12 , H01L21/52 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/50 , H01L21/58
Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 69.10 N/m . As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.
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公开(公告)号：DE69305012D1
公开(公告)日：1996-10-31
申请号：DE69305012
申请日：1993-07-01
Applicant: IBM
IPC: H01L21/56 , H01L21/60 , H01L23/12 , H01L23/28 , H01L21/52 , H01L23/29 , H01L23/31 , H01L23/50 , H01L21/58
Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 69.10 N/m . As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.
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