公开(公告)号：DE3166874D1

公开(公告)日：1984-11-29

申请号：DE3166874

申请日：1981-12-16

Applicant: IBM

Inventor： DEROBERTIS IGNATIUS JOSEPH ,  HASSAN JAVATHU KUTIKARAN ,  JUDGE ROBERT LEWIS ,  PAIVANAS JOHN ANGELO

IPC: B65G49/07 ,  B65G51/03 ,  B65H5/22 ,  H01L21/677 ,  B65G51/02

Abstract: This transport system contains an air film shuttle conveyor (10) for conveying semiconductor chips (26) from a loading (20) to an unloading station (30), the conveyor comprising a base plate (42) and upstanding side walls (48) extending longitudinally of the base plate, the side walls being spaced apart a distance slightly greater than the lateral dimension of said chips; further included are means providing a laminar air flow which surrounds the chips and forms an air film supporting them and propelling them downstream such that the slight spacing between the chips and the side walls causes the flow resistance to be higher in the one regions defined by said slight spacing than in the region defined by the spacing between the chips, whereby a continuous and flexible separation action occurs between the chips.

公开(公告)号：DE2801609A1

公开(公告)日：1978-08-31

申请号：DE2801609

申请日：1978-01-14

Applicant: IBM

Inventor： JUDGE ROBERT LEWIS ,  WUTKA ANTHONY DALE

IPC: B65G49/07 ,  B65G51/03 ,  B65H29/24 ,  H01L21/677 ,  H01L21/68 ,  B65G51/02