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公开(公告)号:DE3175044D1
公开(公告)日:1986-09-04
申请号:DE3175044
申请日:1981-10-30
Applicant: IBM DEUTSCHLAND , IBM
Inventor: ASCH KARL , GRESCHNER JOHANN DR , KALLMEYER MICHAEL , KULCKE WERNER DR
Abstract: A probe head arrangement for contacting a plurality of closely adjacent conductor lines 2 comprises a minimum of one probe head 3, where a plurality of fingers 4 together with a back 5 are made in one piece of monocrystalline silicon in semiconductor technique. A plurality of such probe heads 3 are composed to form a tester. At the beginning of each test it is determined which fingers 4 are to be, and are not to be placed onto the individual conductor lines 2 of a card 1 to be tested. Subsequently, the short and interruption tests can be implemented after the correlation of finger and probe head addresses with the conductor line addresses.
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公开(公告)号:FR2313801A1
公开(公告)日:1976-12-31
申请号:FR7610901
申请日:1976-04-08
Applicant: IBM
Inventor: KALLMEYER MICHAEL , SOLF BERNHARD
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公开(公告)号:DE69026117T2
公开(公告)日:1996-10-02
申请号:DE69026117
申请日:1990-10-18
Applicant: IBM
Inventor: BOOKE MICHAEL , KALLMEYER MICHAEL , RIZK NABIL , YAU YOU-WEN
IPC: H01J37/302 , H01J37/31 , H05K3/00 , G05B19/402
Abstract: A high precision system for machining substrates by means of an energy beam includes real time digital signal processor control and a deflection system providing control, within a predetermined field of the substrate, of the angle at which the beam machines the substrate. An electron beam is used in a vacuum chamber in a preferred embodiment. The system also includes an x-y table for positioning the substrate and may have provision for detecting the x-y position and angular misregistration of the substrate. Dynamic forms and stigmator control may be used to produce a uniform beam within the field. The system allows a high speed vector machining process, which optimizes the overall system throughput by minimizing the settling time of the deflection system.
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公开(公告)号:DE69026117D1
公开(公告)日:1996-04-25
申请号:DE69026117
申请日:1990-10-18
Applicant: IBM
Inventor: BOOKE MICHAEL , KALLMEYER MICHAEL , RIZK NABIL , YAU YOU-WEN
IPC: H01J37/302 , H01J37/31 , H05K3/00 , G05B19/402
Abstract: A high precision system for machining substrates by means of an energy beam includes real time digital signal processor control and a deflection system providing control, within a predetermined field of the substrate, of the angle at which the beam machines the substrate. An electron beam is used in a vacuum chamber in a preferred embodiment. The system also includes an x-y table for positioning the substrate and may have provision for detecting the x-y position and angular misregistration of the substrate. Dynamic forms and stigmator control may be used to produce a uniform beam within the field. The system allows a high speed vector machining process, which optimizes the overall system throughput by minimizing the settling time of the deflection system.
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公开(公告)号:DE2264030A1
公开(公告)日:1974-07-18
申请号:DE2264030
申请日:1972-12-29
Applicant: IBM DEUTSCHLAND
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