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    THERMALLY CONDUCTIVE COMPOSITE INTERFACE, COOLED ELECTRONIC ASSEMBLIES EMPLOYING THE SAME, AND METHODS OF FABRICATION THEREOF
    2.
    发明申请
    THERMALLY CONDUCTIVE COMPOSITE INTERFACE, COOLED ELECTRONIC ASSEMBLIES EMPLOYING THE SAME, AND METHODS OF FABRICATION THEREOF 审中-公开
    导热组合物接口，使用其的冷却电子组件及其制造方法

    公开(公告)号：WO2007144264A2

    公开(公告)日：2007-12-21

    申请号：PCT/EP2007055260

    申请日：2007-05-30

    Applicant: IBM ,  IBM UK ,  CAMPBELL LEVI ,  CHU RICHARD ,  ELLSWORTH MICHAEL ,  FOGEL KEITH ,  IYENGAR MADHUSUDAN ,  SCHMIDT ROGER ,  SIMONS ROBERT

    Inventor： CAMPBELL LEVI ,  CHU RICHARD ,  ELLSWORTH MICHAEL ,  FOGEL KEITH ,  IYENGAR MADHUSUDAN ,  SCHMIDT ROGER ,  SIMONS ROBERT

    CPC classification number: H01L23/3677 ,  H01L2224/78301 ,  Y10T29/49128 ,  Y10T29/4935 ,  H01L2924/00014

    Abstract: A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to be cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.

    Abstract translation: 提供了复合界面和制造方法，用于将冷却组件连接到电子设备。 界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。 将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。 至少一些线部分地位于较高热通量的第一区域上，并部分地延伸在较低热通量的第二区域上，其中第一和第二区域是待冷却表面的不同区域。 这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

    Liquid cooled data center with coolant supply lines
    3.
    发明专利
    Liquid cooled data center with coolant supply lines 未知

    公开(公告)号：GB2499158A

    公开(公告)日：2013-08-07

    申请号：GB201309199

    申请日：2011-10-27

    Applicant: IBM

    Inventor： SCHMIDT ROGER ,  IYENGAR MADHUSUDAN

    IPC: H05K7/20

    Abstract: Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines.

    4.
    发明专利
    未知

    公开(公告)号：DE602005005859D1

    公开(公告)日：2008-05-15

    申请号：DE602005005859

    申请日：2005-12-07

    Applicant: IBM

    Inventor： CAMPBELL LEVI ,  CHU RICHARD ,  ELLSWORTH MICHAEL ,  IYENGAR MADHUSUDAN ,  SCHMIDT ROGER ,  SIMONS ROBERT

    IPC: H05K7/20 ,  F25D23/12 ,  H01L23/473

    Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.

    System for cooling an electronics rack comprising a fluidly connected air-to-liquid heat exchanger and at least one cooling plate
    5.
    发明专利
    System for cooling an electronics rack comprising a fluidly connected air-to-liquid heat exchanger and at least one cooling plate 未知

    公开(公告)号：GB2496020A

    公开(公告)日：2013-05-01

    申请号：GB201216684

    申请日：2012-09-19

    Applicant: IBM

    Inventor： SCHMIDT ROGER ,  LYENGAR MADHUSUDAN ,  GRAYBILL DAVID ,  COICO PATRICK ANTHONY ,  KAMATH VINOD ,  STEINKE MARK EDWARD ,  KOCHUPARAMBIL JOSE BEJOY ,  CHAINER TIMOTHY JOSEPH

    IPC: H05K7/20

    Abstract: A cooling apparatus for an electronics rack includes an air-to-liquid heat exchanger 530, one or more coolant-cooled structures 520 and a tube; the heat exchanger 530, is disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section; the coolant-cooled structure(s) 520 are in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant; the tube connects in fluid communication one coolant-cooled structure 520 and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger 530 and the coolant-cooled structure 520. Also disclosed is a method of fabricating the above cooling apparatus and a cooled electronic system comprising the above cooling apparatus and an electronics rack. The cooling apparatus may also comprise an airflow director 512 configured to redirect airflow exhausting from the electronics rack at the outlet side through an airflow return pathway 531 to the inlet side of the rack, where the heat exchanger 530 may be provided in the airflow return pathway 531.

    LIQUID COOLED DATA CENTER WITH COOLANT SUPPLY LINES
    6.
    发明专利
    LIQUID COOLED DATA CENTER WITH COOLANT SUPPLY LINES 未知

    公开(公告)号：CA2814722A1

    公开(公告)日：2012-05-03

    申请号：CA2814722

    申请日：2011-10-27

    Applicant: IBM

    Inventor： SCHMIDT ROGER ,  IYENGAR MADHUSUDAN

    IPC: H05K7/20

    Abstract: Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines.

    LIQUID COOLED DATA CENTER WITH COOLANT SUPPLY LINES
    7.
    发明专利
    LIQUID COOLED DATA CENTER WITH COOLANT SUPPLY LINES 未知

    公开(公告)号：CA2814722C

    公开(公告)日：2018-09-04

    申请号：CA2814722

    申请日：2011-10-27

    Applicant: IBM

    Inventor： SCHMIDT ROGER ,  IYENGAR MADHUSUDAN

    IPC: H05K7/20

    Abstract: Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines.

    Liquid cooled data center with coolant supply lines
    8.
    发明专利
    Liquid cooled data center with coolant supply lines 未知

    公开(公告)号：GB2499158B

    公开(公告)日：2014-08-20

    申请号：GB201309199

    申请日：2011-10-27

    Applicant: IBM

    Inventor： SCHMIDT ROGER ,  IYENGAR MADHUSUDAN

    IPC: H05K7/20

    Abstract: Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets configured to house computer equipment. At least two coolant supply lines from which the cabinets receive coolant are made available, with each of the supply lines providing the coolant to multiple cabinets. Moreover, the cabinets are arranged in rows and columns such that the cabinets along a row are spaced closer together than the cabinets along a column. Furthermore, each row of the cabinets receives coolant from alternating coolant supply lines.

    Flüssigkeitsgekühltes Rechenzentrum mit Kühlmittelzuleitungen
    9.
    发明专利
    Flüssigkeitsgekühltes Rechenzentrum mit Kühlmittelzuleitungen 未知

    公开(公告)号：DE112011103570T5

    公开(公告)日：2013-07-25

    申请号：DE112011103570

    申请日：2011-10-27

    Applicant: IBM

    Inventor： SCHMIDT ROGER ,  IYENGAR MADHUSUDAN

    IPC: H05K7/20

    Abstract: Verfahren zum Verhindern des Überhitzens von Computereinheiten in einem Schrank, wenn ein Versorgungskühlmittel für einen Kühler in dem Schrank ausfällt. Bei einem Ausführungsbeispiel handelt es sich um ein Rechenzentrum, das eine Mehrzahl von Schränken und mindestens zwei Kühlmittelzuleitungen aufweist. Die Schränke sind so eingerichtet, dass sie Computereinheiten aufnehmen, und die Kühlmittelzuleitungen versorgen die Schränke mit Kühlmittel. Die Schränke sind ferner derart in mindestens einer Reihe benachbarter Schränke angeordnet, dass jede Reihe benachbarter Schränke von sich abwechselnden Kühlmittelzuleitungen mit Kühlmittel versorgt wird.

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