公开(公告)号：GB2585319B

公开(公告)日：2021-06-30

申请号：GB202017218

申请日：2019-05-02

Applicant: IBM

Inventor： KATSUYUKI SAKUMA ,  JOHN KNICKERBOCKER ,  STEPHEN JOHN HEISIG ,  JOHN JEREMY RICE ,  GADDI BLUMROSEN

IPC: G06F3/01

Abstract: Writing recognition using a wearable pressure sensing device includes receiving pressure measurement data from a pressure sensor disposed upon a body part of a user. The pressure measurement data is indicative of a change in pressure of the body part due to an interaction of the body part with a medium indicative of a writing gesture by the user. A start boundary and end boundary for each of a plurality of writing symbols is detected based upon the pressure measurement data. At least one feature of the pressure measurement data associated with the plurality of writing symbols is extracted. A symbol pattern is detected based upon the extracted features, and at least one letter is detected based upon the symbol pattern. A word is detected based upon the detected at least one letter.

公开(公告)号：GB2585319A

公开(公告)日：2021-01-06

申请号：GB202017218

申请日：2019-05-02

Applicant: IBM

Inventor： KATSUYUKI SAKUMA ,  JOHN KNICKERBOCKER ,  STEPHEN JOHN HEISIG ,  JOHN JEREMY RICE ,  GADDI BLUMROSEN

IPC: G06F3/01

Abstract: Writing recognition using a wearable pressure sensing device includes receiving pressure measurement data from a pressure sensor disposed upon a body part of a user. The pressure measurement data is indicative of a change in pressure of the body part due to an interaction of the body part with a medium indicative of a writing gesture by the user. A start boundary and end boundary for each of a plurality of writing symbols is detected based upon the pressure measurement data. At least one feature of the pressure measurement data associated with the plurality of writing symbols is extracted. A symbol pattern is detected based upon the extracted features, and at least one letter is detected based upon the symbol pattern. A word is detected based upon the detected at least one letter.

公开(公告)号：GB2603623A

公开(公告)日：2022-08-10

申请号：GB202117762

申请日：2021-12-09

Applicant: IBM

Inventor： KATSUYUKI SAKUMA ,  MUKTA GHATE FAROOQ ,  PAUL S ANDRY ,  RUSSELL KASTBERG

IPC: H01L21/56 ,  H05K3/34

Abstract: Method of bonding a semiconductor chip 401 to an organic laminate substrate 403 using solder. Without cooldown from the bonding temperature to room temperature, the underfill between the semiconductor chip and the organic laminate substrate is dispensed. The underfill is cured within a range of temperatures higher than the underfill dispense temperature. Alternatively, a semiconductor chip that has pillars 402 protruding from a lower surface at a pitch of 55 microns or less, has caps of first solder 406 affixed to lower ends of the pillars. The organic laminate substrate has pads 404 protruding from an upper surface thereof at the same pitch as the semiconductor chip, with caps of second solder 408 affixed to upper faces of the pads. Two or more dots of volatile tacky adhesive are attached to the upper surface of the organic laminate substrate to the lower surface of the semiconductor chip.