公开(公告)号：JP2010263205A

公开(公告)日：2010-11-18

申请号：JP2010096609

申请日：2010-04-20

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： KATOPIS GEORGE A ,  BUCHWALTER STEPHEN L ,  TSAPEPAS STELIOS G ,  KNICKERBOCKER JOHN U ,  PAUL S ANDRY ,  WEBB BUCKNELL C

IPC: H01L23/12 ,  H01L23/32

CPC classification number: H01L23/49827 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00 ,  H01L2224/05552

Abstract: PROBLEM TO BE SOLVED: To provide an interposer substrate assembly such that an integrated circuit chip can be reworked, and to provide an electronic device assembly and a method of manufacturing them. SOLUTION: A substrate 310 is fabricated of a material having a first thermal expansivity; and an interposer 330 is fabricated of a material having a second thermal expansivity different from the first expansivity. There is a coefficient of thermal expansion mismatch between the substrate 310 and the interposer 330 or chip 320. The interposer 330 is coupled to the substrate 310 via a first plurality of electrical contacts 315 and an underfill adhesive 316 at least partially surrounding the electrical contacts 315 to bond the interposer 330 to the substrate 310, thereby reducing strain applied on the first electrical contacts 315. The integrated circuit chip 320 is coupled to the interposer 330 via a second plurality of electrical contacts 325 without use of an adhesive surrounding the second plurality of electrical contacts 325. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种插入器基板组件，使得可以对集成电路芯片进行返工，并提供电子器件组件及其制造方法。 解决方案：衬底310由具有第一热膨胀性的材料制成; 并且插入件330由具有不同于第一扩展性的第二热膨胀性的材料制成。 衬底310和插入器330或芯片320之间存在热膨胀失配系数。插入器330经由第一多个电触点315和底部填充粘合剂316耦合到衬底310，至少部分地围绕电触头315 以将内插器330接合到基板310，从而减小施加在第一电触点315上的应变。集成电路芯片320经由第二多个电触点325而耦合到插入器330，而不使用围绕第二多个 电触点325.版权所有（C）2011，JPO＆INPIT

公开(公告)号：GB2543224A

公开(公告)日：2017-04-12

申请号：GB201701252

申请日：2015-11-03

Applicant: IBM

Inventor： PAUL S ANDRY ,  JEFFREY GELORME ,  CORNELIA K TSANG ,  BUCKNELL WEBB

IPC: H01L21/683 ,  B32B7/12

Abstract: The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The penetration depths of the adhesive and ablation layers are selected such that no more than a negligible amount of the ablation fluence reaches the surface of the device wafer.

公开(公告)号：GB2543224B

公开(公告)日：2017-11-08

申请号：GB201701252

申请日：2015-11-03

Applicant: IBM

Inventor： PAUL S ANDRY ,  JEFFREY GELORME ,  CORNELIA K TSANG ,  BUCKNELL WEBB

IPC: H01L21/683 ,  B32B7/12

公开(公告)号：GB2603623A

公开(公告)日：2022-08-10

申请号：GB202117762

申请日：2021-12-09

Applicant: IBM

Inventor： KATSUYUKI SAKUMA ,  MUKTA GHATE FAROOQ ,  PAUL S ANDRY ,  RUSSELL KASTBERG

IPC: H01L21/56 ,  H05K3/34

Abstract: Method of bonding a semiconductor chip 401 to an organic laminate substrate 403 using solder. Without cooldown from the bonding temperature to room temperature, the underfill between the semiconductor chip and the organic laminate substrate is dispensed. The underfill is cured within a range of temperatures higher than the underfill dispense temperature. Alternatively, a semiconductor chip that has pillars 402 protruding from a lower surface at a pitch of 55 microns or less, has caps of first solder 406 affixed to lower ends of the pillars. The organic laminate substrate has pads 404 protruding from an upper surface thereof at the same pitch as the semiconductor chip, with caps of second solder 408 affixed to upper faces of the pads. Two or more dots of volatile tacky adhesive are attached to the upper surface of the organic laminate substrate to the lower surface of the semiconductor chip.