公开(公告)号：MY123847A

公开(公告)日：2006-06-30

申请号：MYPI19974824

申请日：1997-10-14

Applicant: IBM

Inventor： KENNETH MICHAEL FALLON ,  HORMAZDYAR MINOCHER DALAL ,  GENE JOSEPH GAUDENZI ,  CYNTHIA SUSAN MILKOVICH

IPC: H05K3/34 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  H05K13/04

Abstract: A STRUCTURE AND METHOD IS DISCLOSED FOR DIRECTLY ATTACHING A DEVICE (42,44,46,48) OR PACKAGE ON FLEXIBLE ORGANIC CIRCUIT CARRIERS (23) HAVING LOW COST AND HIGH RELIABILITY.IC CHIPS WITH A NEW SOLDER INTERCONNECT STRUCTURE, COMPRISED OF A LAYER (43) OF PURE TIN, DEPOSITED ON THE TOP OF HIGH MELTING PB-SN SOLDER BALLS (41) ARE EMPLOYED FOR JOINING. THESE METHODS, TECHNIQUES AND METALLURGICAL STRUCTURES ENABLES DIRECT ATTACHMENT OF ELECTRONIC DEVICES OF ANY COMPLEXITY TO ANY SUBSTRATE AND TO ANY LEVEL OF PACKAGING HIERARCHY.ALSO, DEVICES OR PACKAGES HAVING OTHER JOINING TECHNOLOGIES, EG. SMT, BGA, TBGA, ETC. COULD BE JOINED ONTO THE FLEXIBLE CIRCUIT CARRIER.(FIG.6)