公开(公告)号：DE2965205D1

公开(公告)日：1983-05-19

申请号：DE2965205

申请日：1979-09-24

Applicant: IBM

Inventor： TYNAN EUGENE ,  CHAUDHARI PRAVEEN ,  KIESSLING JOHN B ,  PERLMAN DAVID ,  VON GUTFELD ROBERT

IPC: H01R43/00 ,  B23K26/22 ,  H01L21/60 ,  H01R43/02 ,  H05K3/32 ,  B23K26/00 ,  B23K17/00 ,  B23K15/00

Abstract: 1. A method for bonding a metallic wire (13) to a microcircuit conductor (11), characterized in that it includes the steps of : a. applying said wire to the conductor, b. maintaining said wire in close contact with said conductor, c. applying a focussed energy beam (14) directed towards a point at least tangentially in contact with said wire, and forming a hole in said conductor, and d. applying additional energy to portions of said wire adjacent to said point for melting the wire metal so that the metal flows into said hole (15) to form an electrical contact between the wire and the conductor.

公开(公告)号：CA1135871A

公开(公告)日：1982-11-16

申请号：CA336708

申请日：1979-10-01

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  KIESSLING JOHN B ,  PERLMAN DAVID J ,  TYNAN EUGENE E ,  VON GUTFELD ROBERT J

IPC: H01R43/00 ,  B23K26/22 ,  H01L21/60 ,  H01R43/02 ,  H05K3/32 ,  H05K3/00

Abstract: METHOD OF BONDING WIRES TO PASSIVATED CHIP MICROCIRCUIT CONDUCTORS A wire is positioned in intimate contact with a microcircuit hip above a conductor line or pad on the chip. The line is protected by a thin film layer of passivating or insulating material deposited upon the chip. A short pulse, focussed, energy source such as a laser beam drills a hole through or on the edge of the wire, and also opens a hole drawn through the insulating material to expose the conductor line. Then energy is directed upon the portion of the wire surrounding the hole to melt metal from the wire down into the hole which coalesces with molten metal below to form an electrical and mechanical bond of the wire to the line. YO978-042