公开(公告)号：JPH08297286A

公开(公告)日：1996-11-12

申请号：JP12586395

申请日：1995-04-26

Applicant: IBM

Inventor： KIMURA ATSUO

IPC: G03B21/132 ,  G02F1/1335 ,  G02F1/1339 ,  G02F1/1341

Abstract: PURPOSE: To provide a projection type liquid crystal display device whose display quality is improved by improving display luminance, and preventing nonuniformity of orientation and orientation failure by spacers in a liquid crystal light bulb used particularly in the projection type liquid crystal display device. CONSTITUTION: A picture element array area 4 in which display electrodes composed of an aluminium(Al) thin film as a light reflecting film are formed with respective picture elements, is formed on a silicon substrate 2, and a counter electrode 16 is arranged on a glass substrate 14 being a counter substrate. The silicon substrate 2 and the glass substrate 14 are oppositely stuck together by belt-like spacers 6, 8, 10 and 12 which are juxtaposed in a plurality on the outside periphery of the picture element array area 4 and are composed of adhesive resin. A liquid crystal 18 is sealed in an area between the picture element array area 4 and the counter electrode 16. A spacer is not formed on the picture element array area 4. The belt-like spacers 6 to 12 are constituted so that a thickness (a cell gap) between the picture element array area 4 and the counter electrode 16 is kept constant by sticking the upper and lower substrates together on the outer periphery of the picture element array area 4.

公开(公告)号：JPH07113842A

公开(公告)日：1995-05-02

申请号：JP24438593

申请日：1993-09-30

Applicant: IBM

Inventor： HIRANO TOSHIKI ,  KIMURA ATSUO ,  MORI SHINICHIRO

IPC: G01R31/26 ,  B81B3/00 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L21/66

Abstract: PURPOSE: To provide a probe structure having a precise pitch by arranging plural cavities whose positions are adjusted to a contact point pad on a device when the probe structure is contacted with a semiconductor device of an inspec tion object, covering them with an elastic thin film, and arranging a conductive projecting part and a lead part on the thin film. CONSTITUTION: A silicon oxide coating film having a thickness of several thousand Å is formed on a silicon substrate 120, and a micropore is formed in a position adjusted to a contact point pad position on an LSI by photolithography. A part just under the micropore is selectively dug down by plasma ethching, and a cavity 140 is formed. Next, a spin coat is performed on the whole by an organic coating film layer 130 having a thickness of several μm, and a diaphragm is formed on the cavity. Next, a metallic lead 110 is formed, and a metallic projecting contact part 101 is formed by plating. An LSI 200 of an inspection object can be inspected by contacting a contact part 101 with its contact point pad 210 at inspection time.

公开(公告)号：JPH08160403A

公开(公告)日：1996-06-21

申请号：JP30372894

申请日：1994-12-07

Applicant: IBM

Inventor： KIMURA ATSUO

IPC: G02F1/13 ,  G02F1/1333 ,  G02F1/1345 ,  G02F1/136 ,  G09F9/00 ,  G09G3/36 ,  H01L23/498 ,  H01L23/538 ,  H04N5/66

Abstract: PURPOSE: To provide a picture element array board of a liquid crystal display device, a method for the manufacture and an image forming method using the picture element array board, capable of lowering board cost and shortening the length of wiring to a drive element, resulting in the decrease in wiring resistance and a burden on a drive power source. CONSTITUTION: A silicon board 1 is used as an LCD picture element array and formed to have a through-hole drilled by means of an anisotropic etching process or the like. An insulating layer 5 is formed in the through-hole and wiring conductor layers (e.g. Cr-Cu-Au layer) 8 are formed on the layer 5 to the preset pattern. In addition, the wiring conductor layers 8 are bonded to each other via conductor layers (e.g. Cr-Cu-Au layer) 8' at the side of drive elements 10 and solder layers 9, or a thermo-crimping means for the layers 8 and Cr-Cu-Au layer 8'. The LCD picture element array on the surface of the silicon board 1 is thereby connected to the drive elements 10 on the reverse side or the like.