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公开(公告)号：AU4944700A
公开(公告)日：2001-01-09
申请号：AU4944700
申请日：2000-06-15
Applicant: IBM
Inventor： BIEBUYCK HANS , DELAMARCHE EMMANUEL , GEISSLER MATTHIAS , KIND HANNES , MICHEL BRUNO
Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.
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公开(公告)号：DE60024046T2
公开(公告)日：2006-07-27
申请号：DE60024046
申请日：2000-06-15
Applicant: IBM
Inventor： BIEBUYCK HANS , DELAMARCHE EMMANUEL , GEISSLER MATTHIAS , KIND HANNES , MICHEL BRUNO
Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.
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公开(公告)号：DE60024046D1
公开(公告)日：2005-12-22
申请号：DE60024046
申请日：2000-06-15
Applicant: IBM
Inventor： BIEBUYCK HANS , DELAMARCHE EMMANUEL , GEISSLER MATTHIAS , KIND HANNES , MICHEL BRUNO
Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.
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