公开(公告)号：WO9900834A3

公开(公告)日：1999-06-10

申请号：PCT/GB9801729

申请日：1998-06-12

Applicant: IBM ,  IBM UK

Inventor： FARQUHAR DONALD SETON ,  KLODOWSKI MICHAEL JOSEPH ,  PAPATHOMAS KONSTANTINOS ,  WILCOX JAMES ROBERT

IPC: H01L21/60 ,  H01L21/54 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/3128 ,  H01L21/54 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: The electrical connections of an integrated circuit chip assembly (12) comprised of an intergrated circuit chip (20) attached to a substrate (14) are encapsulated and reinforced with a high viscosity encapsulant material (40) by dispensing the encapsulant material (40) through an opening (26) in the substrate (14) into the space between the integrated circuit chip (20) and the substrate (14). An integrated circuit chip assembly (12) having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip (20) and the substrate (14) to which the integrated circuit chip (20) is attached is produced.

Abstract translation: 由附接到基板（14）的集成电路芯片（20）组成的集成电路芯片组件（12）的电连接通过分配密封剂材料（40）通过高粘度密封剂材料（40）而被密封和增强 在衬底（14）中的开口（26）进入集成电路芯片（20）和衬底（14）之间的空间。 一种集成电路芯片组件（12），其具有增强的电互连，其由于集成电路芯片（20）和衬底（14）之间的热膨胀系数差异而产生的应力的结果更弱，所述压缩系数与集成电路芯片 生产电路芯片（20）。

公开(公告)号：CZ469799A3

公开(公告)日：2000-05-17

申请号：CZ469799

申请日：1998-06-12

Applicant: IBM

Inventor： FARQUHAR DONALD SETON ,  KLODOWSKI MICHAEL JOSEPH ,  PAPATHOMAS KONSTANTINOS ,  WILCOX JAMES ROBERT

IPC: H01L21/56

公开(公告)号：PL337808A1

公开(公告)日：2000-09-11

申请号：PL33780898

申请日：1998-06-12

Applicant: IBM

Inventor： FARQUHAR DONALD SETON ,  KLODOWSKI MICHAEL JOSEPH ,  PAPATHOMAS KONSTANTINOS ,  WILCOX JAMES ROBERT

IPC: H01L21/60 ,  H01L21/54 ,  H01L21/56 ,  H01L23/31

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

公开(公告)号：CZ9904697A3

公开(公告)日：2000-05-17

申请号：CZ469799

申请日：1998-06-12

Applicant: IBM

Inventor： FARQUHAR DONALD SETON ,  KLODOWSKI MICHAEL JOSEPH ,  PAPATHOMAS KONSTANTINOS ,  WILCOX JAMES ROBERT

IPC: H01L21/56

CPC classification number: H01L2924/14

公开(公告)号：HU0003638A2

公开(公告)日：2001-02-28

申请号：HU0003638

申请日：1998-06-12

Applicant: IBM

Inventor： FARQUHAR DONALD SETON ,  KLODOWSKI MICHAEL JOSEPH ,  PAPATHOMAS KONSTANTINOS ,  WILCOX JAMES ROBERT

IPC: H01L21/60 ,  H01L21/54 ,  H01L21/56 ,  H01L23/31

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

公开(公告)号：ID20506A

公开(公告)日：1998-12-31

申请号：ID980728

申请日：1998-05-18

Applicant: IBM

Inventor： FARQUHAR DONALD SETON ,  KLODOWSKI MICHAEL JOSEPH ,  PAPATHOMAS KONSTANTINOS ,  WILCOX JAMES ROBERT

IPC: H01L21/60 ,  H01L21/54 ,  H01L21/56 ,  H01L23/31 ,  H05K3/38

Abstract: The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.