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    UNDERFILL COMPOSITIONS
    1.
    发明申请
    UNDERFILL COMPOSITIONS 审中-公开
    不完整的组合物

    公开(公告)号：WO02065542A2

    公开(公告)日：2002-08-22

    申请号：PCT/EP0201954

    申请日：2002-01-31

    Applicant: IBM ,  IBM FRANCE

    Inventor： PAPATHOMAS KONSTANTINOS

    IPC: C08L101/00 ,  C08K3/34 ,  C08K3/36 ,  C08K5/1539 ,  C08K5/5415 ,  C08L33/08 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  C08L63/00

    CPC classification number: C08K3/34

    Abstract: An underfill composition having improved mechanical properties resulting from the inclusion of a novel "core-shell" substance. The core-shell substance includes a fine powder, whose particles each having an outer shell with a Tg significantly above room temperature, and an inner core with a Tg significantly below room temperature. The shell substance often includes an acrylate or methacrylate and the core includes a wide range of materials, such as acrylates and silicone or butadiene-based rubbers.

    Abstract translation: 具有由包含新型“核 - 壳”物质而产生的改善的机械性能的底部填充组合物。 核 - 壳物质包括细粉末，其颗粒各自具有显着高于室温的Tg的外壳和显着低于室温的Tg的内核。 壳物质通常包括丙烯酸酯或甲基丙烯酸酯，并且核心包括各种材料，例如丙烯酸酯和硅酮或丁二烯基橡胶。

    UNDERFILL COMPOSITIONS
    2.
    发明申请
    UNDERFILL COMPOSITIONS 审中-公开
    未填充组合物

    公开(公告)号：WO02065542B1

    公开(公告)日：2003-12-18

    申请号：PCT/EP0201954

    申请日：2002-01-31

    Applicant: IBM ,  IBM FRANCE

    Inventor： PAPATHOMAS KONSTANTINOS

    IPC: C08L101/00 ,  C08K3/34 ,  C08K3/36 ,  C08K5/1539 ,  C08K5/5415 ,  C08L33/08 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  C08L63/00

    CPC classification number: C08K3/34

    Abstract: An underfill composition having improved mechanical properties resulting from the inclusion of a novel "core-shell" substance. The core-shell substance includes a fine powder, whose particles each having an outer shell with a Tg significantly above room temperature, and an inner core with a Tg significantly below room temperature. The shell substance often includes an acrylate or methacrylate and the core includes a wide range of materials, such as acrylates and silicone or butadiene-based rubbers.

    Abstract translation: 由于包含新颖的“核 - 壳”物质而具有改进的机械性能的底部填充组合物。 核 - 壳物质包括细粉末，其细颗粒各自具有显着高于室温的Tg的外壳和具有显着低于室温的Tg的内核。 壳体物质通常包含丙烯酸酯或甲基丙烯酸酯，并且核心包括各种各样的材料，例如丙烯酸酯和硅酮或丁二烯基橡胶。

    PRINTED CIRCUIT BOARD HAVING BURIED DECOUPLING CAPACITOR AND PRODUCTION THEREOF
    5.
    发明专利
    PRINTED CIRCUIT BOARD HAVING BURIED DECOUPLING CAPACITOR AND PRODUCTION THEREOF 失效

    公开(公告)号：JPH1056249A

    公开(公告)日：1998-02-24

    申请号：JP14758197

    申请日：1997-06-05

    Applicant: IBM

    Inventor： LAUFFER JOHN M ,  PAPATHOMAS KONSTANTINOS

    IPC: H05K1/16 ,  H05K3/42 ,  H05K3/46

    Abstract: PROBLEM TO BE SOLVED: To obtain a printed circuit board having a decoupled ground bus and a power bus and an extremely large decoupling capacitor by laminating a first conductor foil coated, at least on one side thereof, with a dielectric material together with a second conductor foil on the coating of the dielectric material. SOLUTION: Copper sheets 10, 14 are punched according to a clearance hole pattern on the ground plane and a copper sheet 12 is punched according to a clearance hole pattern on the hot side ASM dry coating sheets 18, 20 are then pasted onto the upper and lower surfaces of the copper sheet 12 and an ASM dry coating sheets 22 is pasted onto the lower surface of the copper sheet 14. Subsequently, these copper sheet/ASM dry coating structures are laminated together with prefabricated cores 24, 26, glass cloths 36, 38 and outer copper foils 40, 42 to produce a composite multilayer board. The composite multilayer board is then punched and processed through plating and outer circuit are made, thus completing a board having four parallel capacitive planes 44, 46, 48, 50.

    METHOD OF AND APPARATUS FOR INTRODUCING INTO AMOULDED HOUSING A SPHERICAL CONTACT BEARING STRUCTURE
    8.
    发明专利
    METHOD OF AND APPARATUS FOR INTRODUCING INTO AMOULDED HOUSING A SPHERICAL CONTACT BEARING STRUCTURE 未知

    公开(公告)号：PL337511A1

    公开(公告)日：2000-08-28

    申请号：PL33751198

    申请日：1998-06-12

    Applicant: IBM

    Inventor： FARQUHAR DONALD SETON ,  PAPATHOMAS KONSTANTINOS

    IPC: H01L21/56 ,  H01L21/60 ,  H01L23/31

    Abstract: The electrical interconnections between an integrated circuit chip assembly are encapsulated and reinforced with a high viscosity encapsulant material in a single step molding process wherein a mold is placed over an integrated circuit chip assembly and encapsulant material is dispensed through an opening in the mold and forced around and under the integrated circuit chip by external pressure encapsulating the integrated circuit chip assembly. An integrated circuit chip assembly having a reinforced electrical connection which is more resistant to weakening as a result is stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

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