Abstract:
An underfill composition having improved mechanical properties resulting from the inclusion of a novel "core-shell" substance. The core-shell substance includes a fine powder, whose particles each having an outer shell with a Tg significantly above room temperature, and an inner core with a Tg significantly below room temperature. The shell substance often includes an acrylate or methacrylate and the core includes a wide range of materials, such as acrylates and silicone or butadiene-based rubbers.
Abstract:
An underfill composition having improved mechanical properties resulting from the inclusion of a novel "core-shell" substance. The core-shell substance includes a fine powder, whose particles each having an outer shell with a Tg significantly above room temperature, and an inner core with a Tg significantly below room temperature. The shell substance often includes an acrylate or methacrylate and the core includes a wide range of materials, such as acrylates and silicone or butadiene-based rubbers.
Abstract:
The electrical connections of an integrated circuit chip assembly (12) comprised of an intergrated circuit chip (20) attached to a substrate (14) are encapsulated and reinforced with a high viscosity encapsulant material (40) by dispensing the encapsulant material (40) through an opening (26) in the substrate (14) into the space between the integrated circuit chip (20) and the substrate (14). An integrated circuit chip assembly (12) having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip (20) and the substrate (14) to which the integrated circuit chip (20) is attached is produced.
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive adhesive having a wide property selective range by using micrometer size range particles of random size coated with a low-melting-point metal. SOLUTION: The coated particles are suspended in a vehicle consisting of a mixture of a thermosetting resin and a fusing agent resin selected for electrical and mechanical property in terms of viscosity, low contraction, screen printing ability and wide range specifications. The vehicle or resin system includes thermosetting alicyclic epoxy, thermosetting phenoxy polymer and thermosetting single-functional limonene oxide. A low-melting-point coating system for the particles contains In, Sn and In-Sn, Sn-Pb, Bi-Sn-In or InAg alloy. The micrometer size range particles contain Cu, Ni, Co, Ag, Pd, Pt, a polymer and a ceramic.
Abstract:
PROBLEM TO BE SOLVED: To obtain a printed circuit board having a decoupled ground bus and a power bus and an extremely large decoupling capacitor by laminating a first conductor foil coated, at least on one side thereof, with a dielectric material together with a second conductor foil on the coating of the dielectric material. SOLUTION: Copper sheets 10, 14 are punched according to a clearance hole pattern on the ground plane and a copper sheet 12 is punched according to a clearance hole pattern on the hot side ASM dry coating sheets 18, 20 are then pasted onto the upper and lower surfaces of the copper sheet 12 and an ASM dry coating sheets 22 is pasted onto the lower surface of the copper sheet 14. Subsequently, these copper sheet/ASM dry coating structures are laminated together with prefabricated cores 24, 26, glass cloths 36, 38 and outer copper foils 40, 42 to produce a composite multilayer board. The composite multilayer board is then punched and processed through plating and outer circuit are made, thus completing a board having four parallel capacitive planes 44, 46, 48, 50.
Abstract:
A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.
Abstract:
The electrical interconnections between an integrated circuit chip assembly are encapsulated and reinforced with a high viscosity encapsulant material in a single step molding process wherein a mold is placed over an integrated circuit chip assembly and encapsulant material is dispensed through an opening in the mold and forced around and under the integrated circuit chip by external pressure encapsulating the integrated circuit chip assembly. An integrated circuit chip assembly having a reinforced electrical connection which is more resistant to weakening as a result is stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.
Abstract:
A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.