公开(公告)号：DE19505748A1

公开(公告)日：1996-08-29

申请号：DE19505748

申请日：1995-02-20

Applicant: IBM

Inventor： KNIGHT STEPHEN ERROLD ,  LUCE STEPHEN ELLINWOOD ,  MCDEVITT THOMAS LEDDY

IPC: G03F7/16 ,  H01L21/027 ,  H01L21/285 ,  H01L21/3105 ,  H01L21/312 ,  G03F7/09 ,  H01L21/469

Abstract: The invention provides a method for substrate preparation prior to applying photoresist to the substrate. A substrate, such as a TEOS-based silicon dioxide or silicon nitride film, is selected and treated with reactive oxygen. The reactive oxygen can comprise ozone or ozone plasma, for example. After treatment of the substrate, the photoresist, preferably an acid-catalyzed photoresist for use with deep UV sensitization, is applied.