公开(公告)号：JPH06275766A

公开(公告)日：1994-09-30

申请号：JP5723793

申请日：1993-03-17

Applicant: IBM

Inventor： TSUKADA YUTAKA ,  KOBAYAKAWA TAIICHI ,  MAEDA YOJI ,  TSUCHIDA SHUHEI

IPC: H01L23/50 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

Abstract: PURPOSE: To provide an electric connecting structure of a semiconductor device for simply electrically and simultaneously mechanically connecting effectively by using a plurality of fine leads at tabs on a substrate mounted with an IC chip and electrodes on a printed circuit board. CONSTITUTION: Leads 120 are fixed at front side and bottom of a substrate 100 via resin tapes 130, 132 and 134. The leads 120 are bent to have circular arc-like protrusions protruding from the same flat surface as the bottom of the substrate in the case of fixing them to the substrate, electrically connected to electrodes 115 on a printed circuit board 110 at the protrusion via solder or conductive adhesive 140, and simultaneously mechanically connected to the substrate and the printed circuit board.