1.
    发明专利
    未知

    公开(公告)号:DE2458736A1

    公开(公告)日:1976-06-16

    申请号:DE2458736

    申请日:1974-12-12

    Abstract: A method and apparatus for monitoring and controlling a plurality of power supplies in a computer or similar complex electronic apparatus provides the steps of normalizing each power supply output according to a common nominal val ue, comparing the normalized values to a reference having values according to the normalized upper and lower limits specified for each power supply, and conducting a quantative measurement of out-of-tolerance test values. The specific upper and lower tolerance values for each normalized output are stored in digital form and the measurement of an out-of-tolerance reading is by comparison to a digital ramp extending only from the specific maximum or minimum tolerance threshold which is exceeded. The testing of plural power supplies having the same upper or lower normalized tolerance can be conducted as a group of tests against the same reference.

    2.
    发明专利
    未知

    公开(公告)号:DE69112389T2

    公开(公告)日:1996-03-21

    申请号:DE69112389

    申请日:1991-06-06

    Applicant: IBM

    Abstract: A module containing an electronic package (4) provides a housing for cooling and protecting the electronic package. In the housing are two metal shells, a top (1) and a bottom (7) shell, which form a common cavity in which the package (4) is completely embedded without touching the inner walls of the cavity. A flexible thermally conductive foil (2,6) is fixed to each of the shells (1,7). The foil is adjustable to the surface of the package (4) and it is isolated from electrically conductive parts of the package. A cooling liquid (8) fills the gaps between the metal shells (1,7) and the foils (2,6). Flexible isolated circuit means (9) connect the package (4) to the outside of the housing, balancing means (3,5) assure the balancing of pressure and volume between the shells (1,7) and further means firmly hold together the housing. The module may be fixed to a board (11) comprising at least one opening in which the module is inserted. The flexible isolated circuit means (9) are electrically connected to the wiring of the board.

    3.
    发明专利
    未知

    公开(公告)号:DE69112389D1

    公开(公告)日:1995-09-28

    申请号:DE69112389

    申请日:1991-06-06

    Applicant: IBM

    Abstract: A module containing an electronic package (4) provides a housing for cooling and protecting the electronic package. In the housing are two metal shells, a top (1) and a bottom (7) shell, which form a common cavity in which the package (4) is completely embedded without touching the inner walls of the cavity. A flexible thermally conductive foil (2,6) is fixed to each of the shells (1,7). The foil is adjustable to the surface of the package (4) and it is isolated from electrically conductive parts of the package. A cooling liquid (8) fills the gaps between the metal shells (1,7) and the foils (2,6). Flexible isolated circuit means (9) connect the package (4) to the outside of the housing, balancing means (3,5) assure the balancing of pressure and volume between the shells (1,7) and further means firmly hold together the housing. The module may be fixed to a board (11) comprising at least one opening in which the module is inserted. The flexible isolated circuit means (9) are electrically connected to the wiring of the board.

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