-
公开(公告)号：DE69112389T2
公开(公告)日：1996-03-21
申请号：DE69112389
申请日：1991-06-06
Applicant: IBM
Inventor： GRUBER HARALD , HORBACH HEINZ GUENTER DIPL ING , KOETZLE GUNTHER DIPL ING , LUDWIG THOMAS DIPL ING , SCHETTLER HELMUT DIPL ING
IPC: H01L23/473 , H01L23/34 , H01L23/42 , H01L25/065 , H01L23/44
Abstract: A module containing an electronic package (4) provides a housing for cooling and protecting the electronic package. In the housing are two metal shells, a top (1) and a bottom (7) shell, which form a common cavity in which the package (4) is completely embedded without touching the inner walls of the cavity. A flexible thermally conductive foil (2,6) is fixed to each of the shells (1,7). The foil is adjustable to the surface of the package (4) and it is isolated from electrically conductive parts of the package. A cooling liquid (8) fills the gaps between the metal shells (1,7) and the foils (2,6). Flexible isolated circuit means (9) connect the package (4) to the outside of the housing, balancing means (3,5) assure the balancing of pressure and volume between the shells (1,7) and further means firmly hold together the housing. The module may be fixed to a board (11) comprising at least one opening in which the module is inserted. The flexible isolated circuit means (9) are electrically connected to the wiring of the board.
-
公开(公告)号：DE69112389D1
公开(公告)日：1995-09-28
申请号：DE69112389
申请日：1991-06-06
Applicant: IBM
Inventor： GRUBER HARALD , HORBACH HEINZ GUENTER DIPL ING , KOETZLE GUNTHER DIPL ING , LUDWIG THOMAS DIPL ING , SCHETTLER HELMUT DIPL ING
IPC: H01L23/473 , H01L23/34 , H01L23/42 , H01L25/065 , H01L23/44
Abstract: A module containing an electronic package (4) provides a housing for cooling and protecting the electronic package. In the housing are two metal shells, a top (1) and a bottom (7) shell, which form a common cavity in which the package (4) is completely embedded without touching the inner walls of the cavity. A flexible thermally conductive foil (2,6) is fixed to each of the shells (1,7). The foil is adjustable to the surface of the package (4) and it is isolated from electrically conductive parts of the package. A cooling liquid (8) fills the gaps between the metal shells (1,7) and the foils (2,6). Flexible isolated circuit means (9) connect the package (4) to the outside of the housing, balancing means (3,5) assure the balancing of pressure and volume between the shells (1,7) and further means firmly hold together the housing. The module may be fixed to a board (11) comprising at least one opening in which the module is inserted. The flexible isolated circuit means (9) are electrically connected to the wiring of the board.
-
公开(公告)号：DE4427309C2
公开(公告)日：1999-12-02
申请号：DE4427309
申请日：1994-08-02
Applicant: IBM
Inventor： DRUSCHKE FRANK , DIEMER ROLAND , ELSNER GERHARD , SCHMID WOLFGANG , BRAUN REINHOLD , GRUBER HARALD , BECK WOLFGANG , KRATZERT RAINER
IPC: G06K19/077 , H01L23/29 , H01L21/50 , H01L23/04 , B29C45/14
Abstract: PCT No. PCT/EP95/02150 Sec. 371 Date Jan. 31, 1997 Sec. 102(e) Date Jan. 31, 1997 PCT Filed Jun. 6, 1995 PCT Pub. No. WO96/04611 PCT Pub. Date Feb. 15, 1996Described is a method for manufacturing of carrier element modules of a thin carrier element (4) and a thereon mounted semiconductor chip (2). This method renders possible the application of chips (2) with great dimensions (macro-chips) and a wide variety of different types. A chip transfer moulding process is designed so that a minimised height-without the need for reworking-is achievable, and therefore a less costly surface mounting of the chips can be applied. The manufactured module according to the invention can be used as well as in flexible circuit boards (e.g. for cameras) or in chipcards. The method according to the present invention has a first step of putting the at least one IC (2) onto the carrier element (4), a second step of contacting the at least one IC (2) with the carrier element (4) and a third step of transfer moulding a transfer moulding compound (18) to encapsulate the IC (2).
-
Patent Agency Ranking
公开(公告)号：DE4427309A1
公开(公告)日：1996-02-15
申请号：DE4427309
申请日：1994-08-02
Applicant: IBM
Inventor： DRUSCHKE FRANK DIPL CHEM DR , DIEMER ROLAND , ELSNER GERHARD DIPL PHYS DR , SCHMID WOLFGANG , BRAUN REINHOLD DIPL ING , GRUBER HARALD , BECK WOLFGANG , KRATZERT RAINER DIPL ING
Abstract: A process is disclosed for producing an IC-module that consists of a thin support element (4) upon which is mounted a semiconductor chip (2). This process also allows the use of IC-components (2) of especially large sizes (macrochips) and various types. The chip is injection moulded so that it has a minimum height without requiring further processing and may be economically surface-mounted. The module may be used both in flexible printed circuit cards (for example in photographic cameras) and in smart cards. In a first step of the process, at least one IC-component (2) is applied on the support element (4), in a second step the IC-component (2) is contacted with the support element (4) and in a third step an injection moulding material (18) is injection moulded around the IC-component (2) so as to envelop it.
-
公开(公告)号：DE3310691A1
公开(公告)日：1984-09-27
申请号：DE3310691
申请日：1983-03-24
Applicant: IBM DEUTSCHLAND
Inventor： STADLER EWALD , WAGNER OTTO DIPL ING , GRUBER HARALD , STAHL RAINER DIPL ING
Abstract: The invention relates to a socket plate for a plug-in connection between a circuit board which is provided with plug pins and a printed circuit, and a circuit module which is provided with plug pins and has an upper and a lower covering plate and a plate which is located between them, is provided with resilient contacts in a sprung manner and is characterised in that it consists of an elastomeric material and has a matrix-like arrangement of continuous slots (7) which lie in rows and columns, in that the cover plates (9, 10) have an identical arrangement of outwardly inclined openings (2), and in that the side walls of the slots and the inclined surfaces of the openings have metallic contact strips (8) resting thereon, and in that this socket plate is held by means of an elastic frame which engages around the edges.
-
公开(公告)号：DE4424396C2
公开(公告)日：1996-12-12
申请号：DE4424396
申请日：1994-07-11
Applicant: IBM
-
公开(公告)号：DE4424396A1
公开(公告)日：1996-01-18
申请号：DE4424396
申请日：1994-07-11
Applicant: IBM
Inventor： DRUSCHKE FRANK DIPL CHEM DR , KRATZERT RAINER DIPL ING , GRUBER HARALD , BECK WOLFGANG , DIEMER ROLAND , SCHMID WOLFGANG , BRAUN REINHOLD DIPL ING , ELSNER GERHARD DIPL PHYS DR
Abstract: The proposal is the use of the prior art C4 technique to produce an electrical connection between an IC unit (2) and a substrate component (4) designed for inclusion in chip cards or other data medium boards. This results in facilities for contact between the IC unit (2) and the substrate component (4) permitting a high degree of integration of the IC unit (2) and a correspondingly large number of contacts between the IC unit (2) and its environment, makes contact possible over the entire surface of the IC unit (2) and, for the same requirements for contact between the IC unit (2) and the substrate (4), lower structural heights of the connection between said IC unit (2) and the substrate (4).
-
公开(公告)号：DE3824654A1
公开(公告)日：1990-02-01
申请号：DE3824654
申请日：1988-07-20
Applicant: IBM DEUTSCHLAND
Inventor： GRUBER HARALD , STADLER EWALD E DIPL ING , HINRICHSMEYER KURT , HORBACH HEINZ-GUENTER
Abstract: The electronic module (11) has a substrate (12) on which a plurality of chips (13) is disposed and a multiplicity of connection pins (26) which are supported on a pin plate (21 - 24) and are electrically connected to the chips (13) via conductors. At the same time, a plurality of pin plates (21 - 24) provided with connecting pins (26) are provided, each of which is supported by means of at least one flexible connecting element (29), provided with the conductors, on a peripheral region (16 - 19) of a substrate (12) having base area in the shape of any desired polygon in a manner such that it can be folded out of a plane essentially aligned with the plane of the substrate (12) into a position below the substrate (12) or vice versa. This provides an electronic module which is less expensive to manufacture and takes up an appreciably smaller base area for a comparable performance. … …
-
-
-
-
-
-
-
Search Results
8
records
(took 0.016 seconds)
