公开(公告)号：DE68916784D1

公开(公告)日：1994-08-18

申请号：DE68916784

申请日：1989-04-20

Applicant: IBM

Inventor： SCHETTLER HELMUT DIPL ING ,  LUDWIG THOMAS DIPL ING ,  WAGNER OTTO M DIPL-ING ,  HAUG WERNER O DIPL ING ,  KLINK ERICH ,  KROELL KARL E DIPL-PHYS ,  STAHL RAINER DIPL ING

IPC: H01L21/60 ,  H01L23/14 ,  H01L23/64

Abstract: Integrated circuit package comprising at least one active integrated circuit chip (1) mounted and electrically connected to a power supply distribution wiring and a chip interconnection and signal wiring both formed on the topsurface of a passive semiconductor interconnection carrier (2) in which a power supply decoupling capacitor is implemented. Spaced wells (4) of a first conductivity type are provided in the surface of said carrier of a second conductivity type. The power supply distribution wiring comprises first and second conductive lines (5, 6) within a first wiring level (WL1). Said first conductive lines (5) are deposited on the surface areas of said wells (4) in an ohmic contact relationship and said second conductive lines (6) are deposited on the surface areas of said carrier (2) between said wells (4) in an ohmic contact relationship. Said first and second conductive lines are connected to first and second terminals of the power supply, respectively, so that the junction capacitance between said wells (4) and the carrier material (2) embedding said wells forms said decoupling capacitor.

公开(公告)号：DE68916784T2

公开(公告)日：1995-01-05

申请号：DE68916784

申请日：1989-04-20

Applicant: IBM

Inventor： SCHETTLER HELMUT DIPL ING ,  LUDWIG THOMAS DIPL ING ,  WAGNER OTTO M DIPL-ING ,  HAUG WERNER O DIPL ING ,  KLINK ERICH ,  KROELL KARL E DIPL-PHYS ,  STAHL RAINER DIPL ING

IPC: H01L21/60 ,  H01L23/14 ,  H01L23/64

Abstract: Integrated circuit package comprising at least one active integrated circuit chip (1) mounted and electrically connected to a power supply distribution wiring and a chip interconnection and signal wiring both formed on the topsurface of a passive semiconductor interconnection carrier (2) in which a power supply decoupling capacitor is implemented. Spaced wells (4) of a first conductivity type are provided in the surface of said carrier of a second conductivity type. The power supply distribution wiring comprises first and second conductive lines (5, 6) within a first wiring level (WL1). Said first conductive lines (5) are deposited on the surface areas of said wells (4) in an ohmic contact relationship and said second conductive lines (6) are deposited on the surface areas of said carrier (2) between said wells (4) in an ohmic contact relationship. Said first and second conductive lines are connected to first and second terminals of the power supply, respectively, so that the junction capacitance between said wells (4) and the carrier material (2) embedding said wells forms said decoupling capacitor.

公开(公告)号：DE69112389T2

公开(公告)日：1996-03-21

申请号：DE69112389

申请日：1991-06-06

Applicant: IBM

Inventor： GRUBER HARALD ,  HORBACH HEINZ GUENTER DIPL ING ,  KOETZLE GUNTHER DIPL ING ,  LUDWIG THOMAS DIPL ING ,  SCHETTLER HELMUT DIPL ING

IPC: H01L23/473 ,  H01L23/34 ,  H01L23/42 ,  H01L25/065 ,  H01L23/44

Abstract: A module containing an electronic package (4) provides a housing for cooling and protecting the electronic package. In the housing are two metal shells, a top (1) and a bottom (7) shell, which form a common cavity in which the package (4) is completely embedded without touching the inner walls of the cavity. A flexible thermally conductive foil (2,6) is fixed to each of the shells (1,7). The foil is adjustable to the surface of the package (4) and it is isolated from electrically conductive parts of the package. A cooling liquid (8) fills the gaps between the metal shells (1,7) and the foils (2,6). Flexible isolated circuit means (9) connect the package (4) to the outside of the housing, balancing means (3,5) assure the balancing of pressure and volume between the shells (1,7) and further means firmly hold together the housing. The module may be fixed to a board (11) comprising at least one opening in which the module is inserted. The flexible isolated circuit means (9) are electrically connected to the wiring of the board.

公开(公告)号：DE69112389D1

公开(公告)日：1995-09-28

申请号：DE69112389

申请日：1991-06-06

Applicant: IBM

Inventor： GRUBER HARALD ,  HORBACH HEINZ GUENTER DIPL ING ,  KOETZLE GUNTHER DIPL ING ,  LUDWIG THOMAS DIPL ING ,  SCHETTLER HELMUT DIPL ING

IPC: H01L23/473 ,  H01L23/34 ,  H01L23/42 ,  H01L25/065 ,  H01L23/44

Abstract: A module containing an electronic package (4) provides a housing for cooling and protecting the electronic package. In the housing are two metal shells, a top (1) and a bottom (7) shell, which form a common cavity in which the package (4) is completely embedded without touching the inner walls of the cavity. A flexible thermally conductive foil (2,6) is fixed to each of the shells (1,7). The foil is adjustable to the surface of the package (4) and it is isolated from electrically conductive parts of the package. A cooling liquid (8) fills the gaps between the metal shells (1,7) and the foils (2,6). Flexible isolated circuit means (9) connect the package (4) to the outside of the housing, balancing means (3,5) assure the balancing of pressure and volume between the shells (1,7) and further means firmly hold together the housing. The module may be fixed to a board (11) comprising at least one opening in which the module is inserted. The flexible isolated circuit means (9) are electrically connected to the wiring of the board.

公开(公告)号：DE3677986D1

公开(公告)日：1991-04-11

申请号：DE3677986

申请日：1986-10-21

Applicant: IBM

Inventor： LUDWIG THOMAS DIPL ING ,  SCHETTLER HELMUT DIPL ING ,  ZUEHLKE RAINER DR ING ,  WAGNER OTTO DIPL ING

IPC: H03K4/02 ,  H03G11/00 ,  H03K5/02 ,  H03K6/04 ,  H03K17/16 ,  H03K19/0185 ,  H03G11/08

Abstract: A method for the digital slope control of the output signals of power amplifiers, as well as a power amplifier suitable for carrying out the method as described. One way of representing the actual slope value is via the number of clock pulses applied to a counter during a measuring interval which depends in its duration on the slope. Such a measuring interval is produced by applying the pulses of a ring oscillator containing one of the power amplifiers to another counter until the overflow of the latter. Another mode of representing the actual slope value consists in counting the number of pulses of the ring oscillator during a measuring interval of predetermined duration. Actual and nominal values of the slope are compared. The results of this comparison change the contents of a left/right-shift register. Its parallel outputs influence, via control lines, control inputs of the power amplifiers in order to alter their slope by switching on or off output transistors arranged in parallel with respect to their switching paths.