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公开(公告)号:EP1370966A4
公开(公告)日:2008-12-24
申请号:EP02733807
申请日:2002-02-25
Applicant: IBM
Inventor: BLUMRICH MATTHIAS A , CHEN DONG , CHIU GEORGE L , CIPOLLA THOMAS M , COTEUS PAUL W , GARA ALAN G , GIAMPAPA MARK E , HEIDELBERGER PHILIP , KOPSCAY GERALD V , MOK LAWRENCE S , TAKKEN TODD E
IPC: G06F11/10 , G06F9/46 , G06F9/52 , G06F11/00 , G06F11/20 , G06F12/00 , G06F12/02 , G06F12/08 , G06F12/10 , G06F13/00 , G06F13/24 , G06F13/38 , G06F15/173 , G06F15/177 , G06F15/80 , G06F17/14 , H04L1/00 , H04L7/02 , H04L7/033 , H04L12/28 , H04L12/56 , H04L25/02 , H05K7/20 , G06F15/16 , G06F15/00
CPC classification number: H05K7/20836 , F24F11/77 , G06F9/52 , G06F9/526 , G06F15/17381 , G06F17/142 , G09G5/008 , H04L7/0338 , Y02B30/746
Abstract: A fan module including: two or more individual fans, each fan having an air movement means and a motor engaged with the air movement means for accelerating air entering each of the two or more individual fans; a temperature sensor for sensing a temperature associated with the two or more fans and for outputting a first signal corresponding to the temperature; rotational speed sensor for outputting a second signal corresponding to a rotational speed of each of the two or more fans; and a processor for receiving the first and second signals and controlling the two or more individual fans based on the first and second signals.
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公开(公告)号:DE60237433D1
公开(公告)日:2010-10-07
申请号:DE60237433
申请日:2002-02-25
Applicant: IBM
Inventor: BLUMRICH MATTHIAS A , CHEN DONG , CHIU GEORGE L , CIPOLLA THOMAS M , COTEUS PAUL W , GARA ALAN G , GIAMPAPA MARK E , HEIDELBERGER PHILIP , KOPSCAY GERALD V , MOK LAWRENCE S , TAKKEN TODD E
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公开(公告)号:CA2437039A1
公开(公告)日:2002-10-24
申请号:CA2437039
申请日:2002-02-25
Applicant: IBM
Inventor: BLUMRICH MATTHIAS A , CHIU GEORGE L , TAKKEN TODD E , CIPOLLA THOMAS M , CHEN DONG , MOK LAWRENCE S , COTEUS PAUL W , GARA ALAN G , KOPSCAY GERALD V , HEIDELBERGER PHILIP , GIAMPAPA MARK E
IPC: G06F11/10 , G06F9/46 , G06F9/52 , G06F11/00 , G06F11/20 , G06F12/00 , G06F12/02 , G06F12/08 , G06F12/10 , G06F13/00 , G06F13/24 , G06F13/38 , G06F15/173 , G06F15/177 , G06F15/80 , G06F17/14 , H04L1/00 , H04L7/02 , H04L7/033 , H04L12/28 , H04L12/56 , H04L25/02 , H05K7/20 , G06F15/16 , G06F15/00
Abstract: A novel massively parallel supercomputer of hundreds of teraOPS-scale includ es node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC). The ASIC nodes (20) are interconnected by multiple independent networks (26) that optimally maximizes packet communications throughput and minimizes latency. The multiple networks may include three high-speed networ ks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance.
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