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    HINGE CONSTITUTION WITH HEAT PIPE AND METHOD THEREFOR
    2.
    发明专利
    HINGE CONSTITUTION WITH HEAT PIPE AND METHOD THEREFOR 失效

    公开(公告)号：JP2001005567A

    公开(公告)日：2001-01-12

    申请号：JP2000124404

    申请日：2000-04-25

    Applicant: IBM

    Inventor： CIPOLLA THOMAS M ,  MOK LAWRENCE S

    IPC: F28D15/02 ,  G06F1/16 ,  G06F1/20 ,  H05K5/02 ,  H05K7/20

    Abstract: PROBLEM TO BE SOLVED: To make completely buildable a display assembly by setting a manufacture mode for absorbing bending stress generated in a heat pipe before a computer is assembled. SOLUTION: The hinge structure 40 has a winding type tubular part 46 forming an opening 48, which is extended having a clearance around an end part 52 of an auxiliary heat pipe 50, thereby enabling the auxiliary heat pipe 50 to rotate on a hinge 40. A part of a heat-conductive member 26 forming a bent part or a flange 34, a bent part of the hinge 40, or the flange part 60 is placed in the manufacture mode for absorbing the bending stress in the auxiliary heat pipe 50 by extending the rotary shaft of the auxiliary heat pipe 50 on the same line with the rotary shaft of a machine hinge before an upright type computer is assembled.

    METHOD AND DEVICE FOR REALIZING MULTIPLE SECURITY CHECK POINT
    5.
    发明专利
    METHOD AND DEVICE FOR REALIZING MULTIPLE SECURITY CHECK POINT 失效

    公开(公告)号：JP2000222362A

    公开(公告)日：2000-08-11

    申请号：JP2000002513

    申请日：2000-01-11

    Applicant: IBM

    Inventor： KWOK THOMAS Y ,  MOK LAWRENCE S

    IPC: G09C1/00 ,  G06F1/00 ,  G06F17/00 ,  G06F21/00 ,  G06F21/20 ,  G06Q20/34 ,  G06Q20/36 ,  G06Q20/40 ,  G06T7/00 ,  G07F7/08 ,  G07F7/10 ,  H04L9/32 ,  G06F15/00 ,  G06F17/60

    Abstract: PROBLEM TO BE SOLVED: To provide a method and system for executing electronic commercial transactions through the internet by realizing security for accessing and retrieving individual information in a card. SOLUTION: An individual web site including individual or private information is stored in an individual smart Java card. Before a user accesses a site stored in the card, the user is certified according to any one of the PIN, facial image, finger image, eye image, voice characteristics and fingerprints, or the combination of them. Moreover, an encryption engine 210 in the card decodes and compares an input PIN combined with a secrecy key or a security certificate, and verifies the identification of the user. Before a bank account is freely accessed by a user, the computer system of the bank checks the combined secrecy data at multiple check points by using an internet security protocol through a web browser for guaranteeing the authenticity of the card and the identification of the user.

    Cooling mechanism of electronic device
    7.
    发明专利
    Cooling mechanism of electronic device 审中-公开
    电子设备冷却机理

    公开(公告)号：JP2004179631A

    公开(公告)日：2004-06-24

    申请号：JP2003348880

    申请日：2003-10-07

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： CIPOLLA THOMAS M ,  JAMAL-EDDINE TAREK J ,  MOK LAWRENCE S

    IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H01L23/427 ,  H01L23/467

    CPC classification number: G06F1/203 ,  F28D15/0275 ,  G06F2200/203 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a cooling mechanism which effectively remove heat from a electronic device with minimal amount of sound while occupying minimal amount of space within the device. SOLUTION: The cooling mechanism 10 comprises a heat sink 54, a first conduction device 32 and convection device 34. The first conduction device conducts heat from a heat source to the heat sink 54. The convection device 34 has a first side 48, a second side 50 and a peripheral dimension. The heat sink 54 is disposed about the peripheral dimension of the convection device. The convection device 34 draws in air 46 through the first side 48 and second side 50 and forces the air 52 radially outward across the heat sink 54. A cooling mechanism 10 is also provided wherein the cooling mechanism has a ratio of heat removal in watts to volume in cubic centimeters from about 1:1 to about 3:11 at a sound level of between about 20 and 40 decibels. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：提供一种冷却机构，其以最小量的声音有效地从电子设备去除热量，同时占据设备内的最小量的空间。 解决方案：冷却机构10包括散热器54，第一导电装置32和对流装置34.第一导电装置将热量从热源传导到散热器54.对流装置34具有第一侧48 ，第二面50和周边尺寸。 散热器54围绕对流装置的周边尺寸设置。 对流装置34通过第一侧48和第二侧50吸入空气46，并迫使空气52径向向外穿过散热器54.还提供冷却机构10，其中冷却机构具有以瓦为单位的散热比 在约20至40分贝之间的声级上，约1：1至3：11立方厘米的体积。 版权所有（C）2004，JPO

    HEAT TRANSFER OF ELECTRONIC APPARATUS
    8.
    发明专利
    HEAT TRANSFER OF ELECTRONIC APPARATUS 失效

    公开(公告)号：JP2000294970A

    公开(公告)日：2000-10-20

    申请号：JP2000076968

    申请日：2000-03-17

    Applicant: IBM

    Inventor： HOUGHAM GARETH GEOFFREY ,  MOK LAWRENCE S

    IPC: F25B21/02 ,  F28D15/02 ,  G06F1/16 ,  G06F1/20 ,  H05K5/02 ,  H05K7/20

    Abstract: PROBLEM TO BE SOLVED: To provide a mechanism and process for transferring and extracting heat to and from a rechargeable heat accumulator incorporated into an housing of an electronic apparatus. SOLUTION: This apparatus transfers, heat that is locally generated by a component of an electronic apparatus 35, such as a portable computer and hence stores heat in a buffer heat accumulator 3 within the housing of the apparatus 35. Peltier effect transfer control elements 61 and 62 are mounted on an external housing such as a docking state 51, defining the border with respect to the accumulator 3 on the surface of the housing. In a portable computer having a battery as a power supply, a heat accumulator is independent, and hence the battery can be used as the heat accumulator.

    9.
    发明专利
    未知

    公开(公告)号：DE69633998D1

    公开(公告)日：2005-01-13

    申请号：DE69633998

    申请日：1996-09-04

    Applicant: IBM

    Inventor： CIPOLLA THOMAS M ,  COLGAN EVAN ,  MELCHER ROBERT L ,  MOK LAWRENCE S ,  NARAYAN CHANDRASEKHAR ,  SHI LEATHEN ,  YANG KEI-HSIUNG

    IPC: G02F1/13 ,  G02F1/133 ,  G02F1/1333 ,  G02F1/136 ,  G09F9/00 ,  H04N5/74 ,  G02F1/1335 ,  H04N9/31

    Abstract: A liquid crystal element, a packaging structure providing thermal and alignment control, a display device including the same, and methods of fabrication and assembly are provided. The liquid crystal element includes: a semiconductor wafer, having microcircuitry and an array of reflective pixels; a layer of electro-optical responsive liquid crystal medium, of uniform thickness, disposed on the reflective pixels; a transparent conductive layer positioned on the liquid crystal, being substantially parallel to the reflective layers, to ensure a uniform thickness of the liquid crystal; and an insulative transparent layer provided on the conductive layer. The liquid crystal element is laminated to an optically flat substrate to limit the out-of-plane distortions thereof. The structure formed by element and substrate are disposed in a substrate holder which is mounted to a wiring board, and coupled to voltage sources for actuating the liquid crystal. During mounting, an aligning fixture is used to ensure proper orientation of the element relative to the related optical elements. Once the element is positioned, a heat sink is coupled to the rear surface of the substrate holder to dissipate heat.

    10.
    发明专利
    未知

    公开(公告)号：DE69633998T2

    公开(公告)日：2005-12-22

    申请号：DE69633998

    申请日：1996-09-04

    Applicant: IBM

    Inventor： CIPOLLA THOMAS M ,  COLGAN EVAN ,  MELCHER ROBERT L ,  MOK LAWRENCE S ,  NARAYAN CHANDRASEKHAR ,  SHI LEATHEN ,  YANG KEI-HSIUNG

    IPC: G02F1/13 ,  G02F1/133 ,  G02F1/1333 ,  G02F1/136 ,  G09F9/00 ,  H04N5/74 ,  G02F1/1335 ,  H04N9/31

    Abstract: A liquid crystal element, a packaging structure providing thermal and alignment control, a display device including the same, and methods of fabrication and assembly are provided. The liquid crystal element includes: a semiconductor wafer, having microcircuitry and an array of reflective pixels; a layer of electro-optical responsive liquid crystal medium, of uniform thickness, disposed on the reflective pixels; a transparent conductive layer positioned on the liquid crystal, being substantially parallel to the reflective layers, to ensure a uniform thickness of the liquid crystal; and an insulative transparent layer provided on the conductive layer. The liquid crystal element is laminated to an optically flat substrate to limit the out-of-plane distortions thereof. The structure formed by element and substrate are disposed in a substrate holder which is mounted to a wiring board, and coupled to voltage sources for actuating the liquid crystal. During mounting, an aligning fixture is used to ensure proper orientation of the element relative to the related optical elements. Once the element is positioned, a heat sink is coupled to the rear surface of the substrate holder to dissipate heat.

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