INTEGRATOR WITH CAPABILITY OF OUTPUT COMPENSATION

    公开(公告)号:JPH0962760A

    公开(公告)日:1997-03-07

    申请号:JP21033995

    申请日:1995-08-18

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To output the same integration result for the same bit pattern even if the variation of an integrating period, a semiconductor process and power source voltage, etc., exists. SOLUTION: This integrator is provided with a first integrator 1 having a first amplifier 1 and integrating reference voltage during an integrating period, a second integrator having a second amplifier 11 and integrating an input signal during the integrating period and a control means 7 outputting the signal adjusting the gain of the first amplifier 1 to the first amplifier 1 and adjusting the gain of the second amplifier 11 by using the signal adjusting this gain, so that the output of the first integrator may be changed according to the integrating period.

    D/A CONVERTER
    2.
    发明专利

    公开(公告)号:JPH08288848A

    公开(公告)日:1996-11-01

    申请号:JP7508495

    申请日:1995-03-31

    Applicant: IBM

    Abstract: PURPOSE: To provide a current output type D/A converter which can appropriately compensate the fluctuation of characteristics caused by each constant current circuit. CONSTITUTION: Concerning a D/A converter 11 with which an analog output current corresponding to digital input data is provided from the output side by electrifying the respective output currents of plural constant current circuits while switching them to the output side or the non-output side corresponding to the digital input data, during a period in which the output currents of all constant current circuits L1 -L255 are switched to the non-output side, the feedback control of output current values from the constant current circuits is performed based on the analog output current on the non-output side.

    Electronic equipment provided with cooling device for inside of enclosure
    3.
    发明专利
    Electronic equipment provided with cooling device for inside of enclosure 有权
    电子设备提供外壳内部的冷却装置

    公开(公告)号:JP2006128243A

    公开(公告)日:2006-05-18

    申请号:JP2004311873

    申请日:2004-10-27

    CPC classification number: G06F1/203 H01L2924/0002 H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To improve the reliability and safety of electronic equipment (especially, CPU) to heat generation by the cooling effect of a heat generating electronic component housed in the enclosure of the electronic equipment by cooling the component when the equipment is operated. SOLUTION: The electronic equipment 10 is provided with enclosures 12 and 14, a substrate 16 arranged in the enclosures 12 and 14, and an electronic component 18 attached to the substrate 16. The equipment 10 is also provided with a heat sink 20 connected to the electronic component 18, connecting means 21 and 22 used for forming a heat-conductive path from the electronic component 18 to the enclosures 12 and 14 by connecting the heat sink 20 to the enclosures 12 and 14 in accordance with the temperature in the enclosures 12 and 14, and a fan 30 which makes cooling air to flow into the enclosures 12 and 14. The connecting means 21 and 22 stimulate the heat conduction from the heat sink 20 to the enclosure 12 having a large radiating area in addition to the cooling (heat radiation) by means of the fan 30 in accordance the temperature. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:为了提高电子设备(特别是CPU)对电子设备的外壳中的发热电子部件的冷却效果的发热的可靠性和安全性,通过在设备中冷却部件 被操作 解决方案:电子设备10设置有外壳12和14,布置在外壳12和14中的基板16以及附接到基板16的电子部件18.设备10还设置有散热器20 连接到电子部件18,用于形成从电子部件18到外壳12和14的导热路径的连接装置21和22,通过将散热器20连接到外壳12和14,根据 外壳12和14以及使冷却空气流入外壳12和14中的风扇30.连接装置21和22除了具有大的辐射面积之外,还能够从散热器20到具有大辐射面积的外壳12的热传导 根据温度通过风扇30进行冷却(散热)。 版权所有(C)2006,JPO&NCIPI

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