公开(公告)号：US3921285A

公开(公告)日：1975-11-25

申请号：US48859274

申请日：1974-07-15

Applicant: IBM

Inventor： KRALL BOGDAN

IPC: H01L21/50 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/50 ,  H01L2224/13111 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/2036 ,  H05K2203/0465 ,  H05K2203/0776 ,  H05K2203/083 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A method for joining microminiature components to a carrying structure wherein the height of the electrical connecting structures are adjusted during the joining process. The height of the electrical connecting structures may either be adjusted during the original joining of the component to the carrying structure or it may be done in a two step solder reflow process. In the two step process the component is first joined to the carrying structure and then an additional height is given to the electrical connecting structures which improves the lifetime of the joining terminals. In each of the alternatives, a bridge together with a vaporizable fluid which wets both the bridge and a surface of the component opposite to the surface which carries the connecting structure. At the temperature of melting of the material used in the connecting structure, the fluid evaporates and surface tension pulls the component closer to the bridge which in turn elongates or increases the height of the electrical connecting structures between the carrying structure and the component.

Abstract translation: 一种用于将微型组件连接到承载结构的方法，其中在连接过程期间调整电连接结构的高度。 电连接结构的高度可以在组件与承载结构的原始接合期间进行调节，或者可以在两步焊接回流工艺中进行。 在两步法中，部件首先连接到承载结构，然后给电连接结构提供额外的高度，这提高了连接端子的寿命。 在每个替代方案中，桥接器与可蒸发的流体一起喷射，桥接器和构件的表面与承载连接结构的表面相对。 在连接结构中使用的材料的熔化温度下，流体蒸发并且表面张力拉动组件更靠近桥接件，这又增加或增加了承载结构和部件之间的电连接结构的高度。

公开(公告)号：DE2231598A1

公开(公告)日：1973-02-08

申请号：DE2231598

申请日：1972-06-28

Applicant: IBM

Inventor： GOLDMANN LEWIS SIGMUND ,  JEANNOTTE DEXTER ANTHONY ,  KRALL BOGDAN

IPC: G01N13/02

公开(公告)号：FR2279306A1

公开(公告)日：1976-02-13

申请号：FR7518144

申请日：1975-06-03

Applicant: IBM

Inventor： KRALL BOGDAN

IPC: H01L21/50 ,  H01L21/60 ,  H05K3/34 ,  H05K7/02 ,  H05K13/04 ,  H01L21/02

Abstract: A method for joining microminiature components to a carrying structure wherein the height of the electrical connecting structures are adjusted during the joining process. The height of the electrical connecting structures may either be adjusted during the original joining of the component to the carrying structure or it may be done in a two step solder reflow process. In the two step process the component is first joined to the carrying structure and then an additional height is given to the electrical connecting structures which improves the lifetime of the joining terminals. In each of the alternatives, a bridge together with a vaporizable fluid which wets both the bridge and a surface of the component opposite to the surface which carries the connecting structure. At the temperature of melting of the material used in the connecting structure, the fluid evaporates and surface tension pulls the component closer to the bridge which in turn elongates or increases the height of the electrical connecting structures between the carrying structure and the component.